Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Other

Hitachi Automotive Engineering Co., Ltd.

Hitachi Automotive Systems, Ltd.

Kaoru Uchiyama

Shinya Igarashi

Mitsukuni Tsutsui

Masahiko Asano

Hitoshi Ishikawa

Shuji Eguchi

Yasuo Akutsu

Izumi Watanabe

Masahide Harada

Minoru Takahashi

Nobukatsu Arai

Chihiro Kobayashi

Masayuki Kozawa

Akira Takasago

Kunito Nakatsuru

Tadashi Isono

Koji Sato

Isamu Yoshida

Takehiko Kowatari

Shiro Yamashita

Masuo Akamatsu

Takayuki Itsuji

Takehide Yokozuka

Masamichi Yamada

Kinya Nakatsu

Kunio Kondo

Takeshi Tokuyama

Osamu Koizumi

Yutaka Nishimura

Toshifumi Usui

Seiji Suda

Takayuki Saito

Atsushi Miyazaki

Shotaro Naito

Kanji Kawakami

Seiko Suzuki

Tokihito Suwa

Shigeru Oho

Atsushi Kanke

Yusuke Takagi

Hiroatsu Tokuda

Yasunori Mouri

Isao Nunokawa

Motohisa Nishihara

Yutaka Misawa

Tsuyoshi Fujita

Hiroaki Hachino

Hirayoshi Tanei

Hisao Sonobe

Hideto Yoshinari

Hiroshi Yoneda

Shinji Hiramitsu

Hitoshi Minorikawa

Shinichi Fujiwara

Tadao Suzuki

Takahiko Tanigami

Hideki Mukuno

Jun Matsui

Masato Kirigaya

Hiroshi Soma

Masahiro Hirama

Naoyuki Ochi

Hiroshi Tomoto

Toshihiko Nakau

A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.

Power module and power module manufacturing method

The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.

Electric power steering apparatus

A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Semiconductor device and electronic control unit using the same

In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

Electronic device

A device for controlling a vehiclecomprising a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon, and plugsandprovided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of said housing; wherein the plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

Device for controlling a vehicle

An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150&#xb0; C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

A device for controlling a vehiclehas a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and the outside of the housing. The plugs have plug pins that are electrically connected to the printed circuit board within the housing.

The output characteristics of the sensing device or the control quantity of the sensing element can be adjusted by extracting an adjusting terminal in addition to a power source terminal, a ground terminal, an output terminal and the like outside a housing containing and protecting an electronic circuit. Further, by arranging the adjusting terminal inside a connector housing containing terminals such as the power source terminal, the ground terminal, the output terminal and the like, it is possible to prevent contact of foreign objects to the adjusting terminal and to water-proof the terminals for preventing corrosion since an associated connector is attached to the connector when the sensing device is actually used.

Characteristics adjusting apparatus of physical quantity sensing device and a thermal type air flow measuring instrument, and associated adjusting method

A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.

Heating resistor type air flow rate measuring apparatus

A device for controlling a vehiclehaving a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon. Plugsandare provided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of the housing. The plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m /g to 3.0 m /g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of &plusmn;50&deg; C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.

Electronic component and method of manufacturing the same

A mask has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions on one surface of an object to be processed to mount thereon conductive particles , and the plurality of holes are opposite to the plurality of electrode portions formed on the object to be processed. A table has a plurality of holes for sucking the object to be processed from the other surface of the object to be processed , and for sucking the particles through the plurality of holes in the mask so that the particles may be mounted on the electrode portions formed on the object to be processed . A hopper contains therein the plurality of conductive particles , prevents the plurality of conductive particles from adhering to each other, and has a slit portion for dropping the plurality of conductive particles by the self-weight. A slit portion in the hopper is moved, facing the upper surface of the mask with a gap between the slit portion and the upper surface of the mask larger than a diameter of the particle , and the hopper is arranged in the front side in the moving direction, and the unit is arranged in the rear side, and the particles not dropped into the holes of the mask being collected by the collecting unit

Bump forming method and bump forming apparatus

Characteristics adjusting means of physical quantity sensing device and thermal type air flow measuring instrument

Growing community of inventors

Hitachiomiya, Japan

Kaoru Uchiyama