Mitsui Sekiyu Kagaku Kogyo Kabushiki Kaisha

Kaoru Tominaga

Tadao Iwata

Disclosed are epoxy resin compositions comprising a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydroquinone and a reaction catalyst, or a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. These epoxy resin compositions as prepared are in a liquid state and hence resin moldings can be manufactured therefrom by such a simple technique as casting. It is also possible to cure these resin compositions at a temperature below 150.degree. C., and the resin moldings obtained therefrom are tough and excellent in impact resistance as well as in heat resistance.

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Chiba, Japan

Kaoru Tominaga