Panasonic Intellectual Property Management Co., Ltd.

Kaoru Satou

Ayaka Suzuki

Haruhiko Kouno

An air conditioner control device includes: a receiver that receives measurement values for ambient temperatures of air conditioners installed inside a facility; and a controller that adjusts setting temperatures for cooling operations (or heating operations) of each of the air conditioners to values that are less (or values that are greater) than the measurement values for each of the air conditioners, when at least one of the measurement values received by the receiver is greater (or less) than a target temperature inside the facility.

Air conditioner control device and air conditioner control method

A cooling device includes: a heat receiver configured to transfer heat from a heat generation body to a refrigerant, a heat radiator that is connected to the heat receiver via a heat radiation path, and a return path that connects the heat radiator and the heat receiver with each other, in which the refrigerant is to circulate in order of the heat receiver, the heat radiation path, the heat radiator, and the return path and cause a gas-liquid two-phase change and cool the heat generation body, and in which the heat receiver includes a heat receiving plate which is in contact with the heat generation body and is configured to absorb the heat, and a heat receiving cover which covers a surface of the heat receiving plate and defines a heat receiving space.

Cooling device and electronic device using same

A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

Growing community of inventors

Tokyo, Japan

Kaoru Satou