Taiyo Yuden Co., Ltd.

Fujitsu Media Devices Limited

Kaoru Sakinada

Yasufumi Kaneda

Osamu Kawachi

Shunichi Aikawa

Yasuyuki Oda

Takuma Kuroyanagi

Takumi Kooriike

Takashi Yamashita

Michio Miura

Osamu Ikata

Akira Moriya

Motoyuki Tajima

Hitoshi Tsukidate

Takashi Miyagawa

Yasuyuki Saitou

Tooru Takezaki

Yoshinori Kondou

An acoustic wave device includes: a support substrate; a piezoelectric substrate that is jointed on the support substrate; a plurality of acoustic wave elements that are provided on the piezoelectric substrate; and an interconnection line that is provided on the piezoelectric substrate and couples the plurality of acoustic wave elements, wherein: the piezoelectric substrate of a first area, on which the plurality of acoustic wave elements are provided, is remained; the piezoelectric substrate of a second area, on which the interconnection line is provided, is remained; the piezoelectric substrate of a third area is for cutting the support substrate; and the piezoelectric substrates of a fourth area is other than the first area, the second area and the third area, the fourth area having a fifth area in which at least a part of the piezoelectric substrate is removed.

Acoustic wave device

Acoustic wave device includes: a piezoelectric substrate; a first IDT located on the piezoelectric substrate; and a second IDT located on the piezoelectric substrate and connected in series to the first IDT, wherein the first IDT and the second IDT share a single common bus bar as a first bus bar of two bus bars of the first IDT and a first bus bar of two bus bars of the second IDT, and the common bus bar has a width not more than two times a wavelength of an acoustic wave propagating through the first and second IDTs, the common bus bar connects to no dummy electrode finger facing a tip of an electrode finger connected to a second bus bar of the two bus bars of the first IDT and the second IDT across a gap.

Acoustic wave device, filter, and duplexer

An acoustic wave device includes: a substrate; a pad formed on the substrate; a cap formed of an inorganic insulating material and located on the substrate, the cap including a cavity located in a surface of the cap at a substrate side and a penetration hole formed in a location overlapping with the pad; a terminal filling the penetration hole, coupled to the pad on the substrate, and formed of solder; and a functional element formed on an upper surface of the substrate and in the cavity, the functional element exciting an acoustic wave.

Acoustic wave device and method of fabricating the same

A method of fabricating an electronic component includes: mounting a device chip on an upper surface of an insulative substrate; forming a sealing portion that seals the device chip; cutting the insulative substrate and the sealing portion; and forming a plated layer covering the sealing portion by barrel plating.

Method of fabricating electronic component

An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

Electronic component module and method for manufacturing the same

An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.

Electronic component and method of manufacturing the same

There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90&#xb0; with the solder melted.

Electronic device and method of fabricating the same

An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.

Acoustic wave device and method for fabricating the same

An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.

Growing community of inventors

Yokohama, Japan

Kaoru Sakinada