Asahi Kasei Kogyo Kabushiki Kaisha

Kaoru Ohmura

Takeo Kimura

Ichiro Shibasaki

Hidehiko Kobayashi

Kazuo Toyomoto

Muneaki Kimura

Tatsumi Arakawa

Tetsuo Shiga

Tetsuhiro Kusunose

Takeki Matsui

Kiichiro Sasaguri

Hiroshi Komoto

Kenji Ito

Sakae Ito

Masaru Matsuura

Hideo Sekiguchi

Ryohei Koyama

A mold-packaged magnetoelectric transducer element such as a Hall element or a magnetoresistance element comprises a magnetosensitive thin layer, electrodes formed on the thin layer for lead-out connection, an unwindowed film support, leads formed on one surface of the film support, conductive resin for connecting the electrodes and the leads, mold resin packaging on the one surface of the film support the remaining except parts of the leads.

Magnetoelectric transducer and fabrication method therefor

A method for manufacturing a fine-patterned thick film conductor structure free from ununiformity in film thickness comprises steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate using the thin metal plate as a cathode electrode to form conductors having a circuit density of no less than three lines/mm and a thickness of 15-200 .mu.m, bonding the electroplated thin metal plate to an insulative substrate with the thin metal plate side facing up and etching the thin metal plate. The fine-patterned conductors are suited for use in small-sized coils, high density connectors and high density wirings. Further disclosed is a method for manufacturing a fine-patterned thick film printed circuit board free from side protrusion comprising steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate to a thickness of 0.3-10 .mu.m at a current density of 0.05-2 A/dm.sup.2, electroplating the thin metal plate to a desired final thickness at a current density of 3-20 A/dm.sup.2, and removing all or the areas other than the land areas of the thin metal plate.

Method for manufacturing a fine-patterned thick film conductor structure

In manufacturing a fine-patterned thick film conductor structure, a thin film conductor layer having a film thickness of 0.1-10 .mu.m is formed on an insulating substrate and conductive material is then electroplated on the thin film conductor layer to the thickness of 34.9-190 .mu.m under the condition of a cathode current density of no less than 5 A/dm.sup.2. In patterning the conductors, a film thickness-to-conductor interspacing ratio is selected to be no less than 1.4 to prevent widthwise thickening of the conductors in the electroplating process. Resulting conductor structure has a circuit density of no less than 5 lines/mm and a film thickness of 35-200 .mu.m. It is useful for a high density printed circuit board and a miniature coil.

Fine-patterned thick film conductor structure and manufacturing method

An article for electrical use such as insulative substrates, electrical circuit borads and electrical elements, wholly or partly consisting out of an aromatic polyamide-imide having a reduced viscosity of from about 0.3 to 1.5, which polyamide-imide may contain a granular material dispersed therein, and a composition comprising 100 parts by weight of said polyamide-imide and additional about 100 to 4,000 parts by weight of a granular material and optionally about 10 to 10,000 parts by weight of a polar organic solvent.

Polyamide-imide compositions and articles for electrical use prepared

An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 - positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

Polymers for use in heat resistant photoresist composition and process

An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 -positions and having therein amide linkages and terminal groups partially substituted with cinnamate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

Heat resistant photoresist composition and process for preparing the same

In a compound semiconductor device such as a magnetoresistance element or Hall element having a compound semiconductor portion such as of InSb and an electrode portion, a portion of the compound semiconductor portion is exposed to energy irradiation to be converted into an alloy state or amorphous state and rendered conductive to form the electrode portion. The portion rendered conductive is contiguous to and in ohmic contact with the unexposed portion of the compound semiconductor and used as a shorting bar electrode or an external lead bonding pad.

Compound semiconductor device having a semiconductor-converted

A semiconductor magnetoresistive element with at least one intermediate terminal comprises first and second electrodes formed at opposite ends of a magnetosensitive portion of the semiconductor magnetoresistive element, a third electrode interposed between the first and second electrodes, and a plurality of shorting bars disposed, with electrical isolation from each other, on at least one of respective sections of the magnetosensitive portion between the first and third electrodes and between the second and third electrodes, whereby the magnetic sensitivity characteristic of the magnetosensitive section between the first and third electrodes is rendered different from that of the magnetosensitive section between the second and third electrodes.

Semiconductor magnetoresistive element having a differential effect

Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO.sub.2 or In.sub.2 O.sub.3, which is not easily dispersible upon application of the above energy.

Thin-film microcircuit board

An epoxy resin composition comprising an epoxy compound having an average of one or more epoxy groups per molecule, an amine curing agent and a reductive metal compound or complex can produce excellent developed color images, and concave-convex images by energy irradiation. The epoxy resin composition can give excellent physical, chemical and electrical properties to the formed images and various inorganic and organic materials can be used as substrate.

Epoxy resin composition for image formation

An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1- and 3-positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1- and 3- positions and having therein amide linkages and terminal groups partially substituted with cinnamate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

A novel printed circuit board with a circuit of high precision having a polymer coat layer between a base and a dispersion imaging material layer and a pattern circuit on undispersed portions of the dispersion imaging material layer. Such a printed circuit board is prepared by a simplified process which comprises essentially two steps, namely, exposure of the dispersion imaging material through a circuit pattern mask to obtain a pattern circuit of the unexposed portions and conductive metal plating wherein said unexposed portions are selectively deposited with the conductive metal due to the specific effect of provision of the polymer coat layer directly under the dispersion imaging material layer.

Printed circuit board made by dispersion imaging

An epoxy resin composition having excellent curability comprising 100 parts by weight of an epoxy resin having at least two epoxy groups per molecule and about 1 to 300 parts by weight of an amide derivative of 4-aminomethyl-1,8-diaminooctane.

Growing community of inventors

Fuji, Japan

Kaoru Ohmura