Dow Global Technolgoies LLC

The Dow Chemical Company

Dow Chemical Korea Limited

Kaoru Ohba

Qi Jiang

Xin Jiang

Eungkyu Kim

Jianhai Mu

Hua Ren

William J Harris

Kenji Takano

Philip E Garrou

Yusuke Yamashita

Jong-Cheol Kim

Takashi Masudo

Ying-Hung So

Hideki Akimoto

Britton Lee Kaliszewski

Masonori Iida

Shinnosuke Abe

Osamu Kishizaki

Ryo Ishibashi

Eung Kyu Kim

Zhuo Wang

Brian B Martin

Albert Charles Marie Achen

Methods for the removal of ionic contaminants from a hydrophilic organic solvent by a mixed bed of ion exchange resins are described. A mixed bed of ion exchange resins with gel-type strong-acid cationic ion exchange resin with a specific moisture holding capacity and gel-type anionic ion exchange resin is used in some embodiments of such methods.

Purification process for hydrophilic organic solvent

The process of making a lithium ion battery cathode comprises the step of forming a slurry of an active material, a nano-size conductive agent, a binder polymer, a solvent and a dispersant. The solvent consists essentially of one or more of a compound of Formula 1, 2, or 3, and the dispersant comprises an ethyl cellulose.

Ethyl cellulose as a dispersant for lithium ion battery cathode production

In the process of producing a lithium ion battery, one or more compounds of Formula 1, 2, 3 or 4 (e.g., N,N-dimethylpropionamide), is used as the solvent in the step of forming a slurry from an active material (e.g., lithium cobalt oxide), a conductive agent (e.g., carbon black), and a binder polymer (e.g., polyvinylidene fluoride).

Solvent systems for use in lithium ion battery production

A solvent consisting essentially of: (A) a first component consisting of N,N-diethylacetamide (DEAC); (B) a second component consisting of 3-methoxy-N, N-dimethyl propionamide (M3DMPA); and (C) an optional third component consisting of one or more glycol ethers or glycol ether acetates; or a solvent consisting essentially of: (1) a first component consisting of one or more acyclic amides of Formula (I): and (2) an optional second component consisting of one or more of DEAC, M3DMPA, N,N-dimethylpropionamide, one or more glycol ethers or glycol ether acetates, and one or more cyclic amides of Formulae (II-IV). 

Amide combinations for cleaning and stripping of electronic parts

The process for synthesizing a poly(amic acid) polymer or a polyimide polymer is improved by using a solvent system consisting essentially of: (A) a first component consisting essentially of at least one of a sulfoxide, e.g., DMSO, and an alkyl phosphate, e.g., triethyl phosphate, and (B) optionally, a second component consisting essentially of at least one aprotic glycol ether, e.g., dipropylene glycol dimethyl ether.

Solvent systems for synthesis of poly(amic acid) and polyimide polymers

Methods for the removal of ionic contaminants from hydrolysable organic solvent by ion exchange resins are described. A mixed bed of ion exchange resin with cationic ion exchange resin and weak-base anionic ion exchange resin is used in such methods.

Purification process for hydrolysable organic solvent

Solvents useful for removing, among other things, photoresists and poly(amic acid)/polyimide from display/semiconductor substrates or electronic processing equipment, consist essentially of:

Sulfoxide/glycol ether based solvents for use in the electronics industry

The process for synthesizing a poly(amic acid) polymer or a polyimide polymer is improved by using a solvent system consisting essentially of:

DMPA-based solvent systems for the synthesis of poly (amic acid) and polyimide polymers

The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards

A process for preparing an epoxy dimer acid ester resin, which comprises reacting (a) an epoxy resin which is a glycidyl ether of a dihydric phenol having a weight average molecular weight of 1,000 to 30,000 and an epoxy equivalent of 300 to 5,000 with (b) a dimer acid in the presence of an organic solvent having an alcoholic hydroxyl group at a concentration such that the solid content of both reactants (a) and (b) ranges from 60 to 90 percent by weight based on the total weight of the reaction mixture. An epoxy dimer acid ester resin prepared by the process and a coating therefrom are also disclosed. The coating is particularly useful for coating a coil of a steel sheet.

Process for preparation of high-molecular-weight epoxy dimer acid ester

Disclosed in a polyamide epoxy ester resin having a weight average molecular weight of 1,000 to 100,000, an epoxy equivalent of 500 to 10,000, and an acid value of not greater than 10, which is prepared by reacting

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Tokyo, Japan

Kaoru Ohba