Kuroda Precision Industries Ltd.

Kaoru Naoi

Tatsuhito Inouchi

Yoichi Ishizaki

Kenichi Shindo

Koichi Sekiguchi

Masahiro Iwasaki

Shinju Ito

In a parallel slider device with a pneumatic linear guide, the stiffness of the mechanical coupling and the air bearing stiffness are prevented from interfering each other such that the parallelism between the two sliders can be maintained at a high precision in a highly reproducible manner. A difference in the slider support stiffness (air bearing stiffness) between a first pneumatic linear guide and a second pneumatic linear guide by varying the sizes of the air gaps and the supply air pressures so that any error in the linearity is accommodated by the changes in the air gap on the side of the linear guide having a lower slider support stiffness in a stable manner.

Parallel slider device with a pneumatic linear guide, control method therefor and measuring device using same

In a parallel slider device, the two sliders are allowed to move in a smooth manner without interfering with each other. A same position command is given to a front servo controller for a front linear servo motor and a rear servo controller for a rear linear servo motor, and the front servo controller and the rear servo controller are provided with mutually different control gains.

Control device for a parallel slider device, control method and measuring device using same

Method for measuring the surface shape of a thin element such as a silicon wafer measures the surface shapes of one surface and the other surface of the thin element by independently measuring the distance each to one surface and to the other surface of the thin element by rotating or moving the thin element within a single plane and independently moving the first and second measuring means along the first and second guide shafts. Apparatus for measuring the surface shape of the thin element measures the surface shapes of one surface and the other surface of the thin element by rotating or moving the thin element supported within the same plane by a supporting means, and independently measuring the distance each to one surface and to the other surface of the thin element by the first and second measuring means while independently moving the first and second sliders along the first and second guide shafts. The method measures the thickness of each part of the thin element based on the surface shapes of one surface and the other surface of the thin element as measured by the method for measuring the surface shape of the thin element and the distance between the first and second measuring means.

Method and apparatus for measuring surface shape of thin element

A thin board holding device,A for holding a thin board in a plane state to measure the thickness of a thin board is disclosed, which has a number of spot supports,with adsorbing portion for holding a thin board,attached by suction to the top. The thin board,is held in a multiple point support fashion to the spot supports,. By moving a measuring terminal of a measuring instrument to a measuring point on the thin board, which has one surface of the thin board,set on the thin board holding device,A, the level of the other surface of the thin board,from a reference surface A supporting the thin board holding device at a reference position is measured. The dimension from the reference position A to a thin board adsorption surface,of the spot support,is used as a computational constant, and the thickness of the thin board is calculated from the measured level of the other surface of the thin board,and the computational constant.

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Yokohama, Japan

Kaoru Naoi