Shin-etsu Chemical Co., Ltd.

Shin-estu Chemical Co., Ltd.

Kaoru Katoh

Kazuaki Sumita

Toshio Shiobara

Masatoshi Asano

Tokue Kojima

Taro Shimoda

Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, &#x2267;100&#xb0; C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by &#x2266;20&#xb0; C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg&#x2212;30)&#xb0; C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg&#x2212;30)&#xb0; C. is &#x2266;42 ppm/&#xb0; C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.

Set of resin compositions for preparing system-in-package type semiconductor device

A method of manufacturing a semiconductor device comprising the steps of (1) applying an underfill composition to a surface of a silicon wafer, (2) dicing the silicon wafer into chips, (3) positioning the chip, and (4) bonding the chip to the substrate, characterized in that

Method of manufacturing a semiconductor device

A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Liquid epoxy resin composition

A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5&#x2013;100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130&#x2013;250&#xb0; C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

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Annaka, Japan

Kaoru Katoh