Hitachi, Ltd.

Kaoru Katayama

Shinichi Kazui

Yasuhiro Iwata

Hiroshi Fukuda

Mitsugu Shirai

Toshihiko Ohta

Mitsunori Tamura

Takeshi Miitsu

Hideaki Sasaki

Mitugu Shirai

Takeshi Takahashi

Tateoki Miyauchi

Tsutomu Shibuya

Mikio Hongo

Ryohei Satoh

Shiro Yamashita

Shigenobu Maruyama

Tsutomu Sakamoto

Haruhisa Sakamoto

Kenichi Inoue

Motoko Kimura

Naoki Watanabe

Takahiro Daikoku

Masahide Harada

Makoto Abe

Akitoyo Konno

Hidetaka Shigi

Kazuo Mera

Takayuki Uda

Kiyoshi Matsui

Mamoru Kobayashi

Toru Nishikawa

Koyo Morita

Minoru Suzuki

Takeshi Kuroda

Katsurou Mizukoshi

Natsuo Arai

Eiichi Kiryuu

Yasuhiro Yamamoto

A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.

Lighting system and liquid crystal display using the same

The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Method for removing solder bumps from LSI

A laser printing apparatus is formed by a laser oscillator , galvano mirrors for scanning the laser light emitted from the laser oscillator , and an f&thgr; lens for focusing the laser light emitted from the laser oscillator on MCCs serving as the member to be printed. The laser oscillator is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs serving as the member to be printed by using the laser light emitted from the laser oscillator

Laser printing method and apparatus

A module is placed inside a chamber that can be sealed hermetically. The module includes a substrate incorporating a plurality of electronic circuit parts, a frame connected to the substrate so as to enclose the plurality of electronic circuit parts, and a cover placed facing the substrate and connected to the frame so as to cover an opening portion of the frame. The pressure in the chamber is reduced to a first pressure P1, and then the pressure is increased from the first pressure P1 to a second pressure P2. A liquid is filled into the module through a hole formed in the cover within the chamber, and the pressure inside the chamber is increased from the second pressure P2 to a third pressure P3. Then, the hole of the cover in the chamber is closed to seal the module hermetically, thereby sealing the liquid in the module. Thereafter, the pressure in the chamber is increased from the third pressure P3 to an atmospheric pressure P0, and the module is taken out of the chamber.

Method for sealing liquid coolant into module

A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.

Apparatus and a method for removing solder from an object

Laser printing method and apparatus for printing characters

There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Surface reformation method of high polymer material

The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Process for manufacturing electronic circuits

A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion. The solder adhering to the second member is melted when heated by the heating portion through the first member and adheres to the first member. As a result, the solder is removed from the second member.

Solder removing apparatus

A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.

Multi-chip module

A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

Laser assisted surface reformation method of high polymer material

Growing community of inventors

Hadano, Japan

Kaoru Katayama