Mitsubishi Petrochemical Company Limited

Toray Industries, Inc.

Mitsubishi Yuka Fine Chemicals Co., Ltd.

Kaoru Kanayama

Shuji Ichikawa

Yoshinobu Ohnuma

Kuniaki Tobukuro

Hiroshi Samejima

Takeshi Nakato

Tadao Takeyama

Noriko Okazaki

Tosio Sugimoto

Tadahide Sato

Hiromi Chiba

A non-crystalline ether-imide type high purity bismaleimide composition represented by formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 each represent a hydrogen atom, a halogen atom, or an alkyl group having from 1 to 4 carbon atoms; R.sup.5 represents a hydrogen atom or a methyl group; and R.sup.6 represents a hydrogen atom, a methyl group or a phenyl group. The non-crystalline bismaleimide (I) has a purity of 95 wt % or higher, a melting point of not higher than 130.degree. C., and exhibits excellent solubility in a solvent. It is prepared by a process comprising uniformly melting a crystalline bismaleimide (I) followed by rapid cooling to solidify or a process comprising subjecting a maleamic acid, which is obtained by addition reaction between a corresponding aromatic ether diamine and maleic anhydride in an aromatic hydrocarbon/aprotic polar solvent mixed solvent, to dehydrating cyclization in the presence of an acid catalyst while azeotropically removing by-produced water with the aromatic hydrocarbon solvent, removing the remaining aromatic hydrocarbon solvent by distillation, withdrawing the produced maleimide in a molten state, and rapidly cooling to solidify.

Non-crystalline ether-imide type high purity bismaleimide composition

A heat resistant composite film is described, which comprises (I) a thermoplastic film and (II) a cured layer of a thermosetting resin composition comprising (A) 100 parts by weight of an aliphatic diamine having a spiroacetal ring, (B) from 5 to 150 parts by weight of an ester derived from maleic acid and an alcohol represented by formula (I), and (C) from 20 to 250 parts by weight of an ester derived from a tetracarboxylic acid and an alcohol represented by formula (I),

Heat resistant composite film

A process for producing an allyl-substituted phenol compound is described, which comprises a combination of a first step in which a phenol is reacted with an allyl halide in the presence of an alkaline aqueous medium to allyl-etherify the phenol and a second step in which the reaction product obtained in the first step and containing the allyl-etherified phenol is subjected to a Claisen rearangement reaction in the absence of a medium. Also, a compound obtained by the above process is described.

Process for producing allyl-substituted phenol compound and the product

A polyalkenylphenol compound represented by formula (I): ##STR1## wherein R represents a hydrogen atom or a methyl group; X represents a hydrogen atom or a halogen atom; and n represents 0 or an integer of from 1 to 10. The compound is useful as a curing agent for epoxy resins or maleimide resins or a starting material for epoxy resins.

Polyalkenylphenol compound

A process for producing a polyglycidyl ether which comprises reacting a mixture of 4-oxy-3-methoxybenzaldehyde and 4-oxybenzaldehyde in the molar ratio of 5/95 to 95/5 with pentaerythritol to give a bisphenol having a spiroacetal ring, and further reacting the bisphenol with epihalohydrin or .beta.-methylepihalohydrin is disclosed. The polyglycidyl ether obtained has excellent solubility in solvents, and the cured product obtained therefrom has excellent elongation, modulus of elasticity, impact resistance, and heat resistance.

Polyglycidyl ethers and a process for producing the same

A process for producing a polymaleimide which comprises reacting an aromatic dialdehyde with 2 to 60 moles, per mole of the aromatic dialdehyde, of aromatic amine represented by the formula (I): ##STR1## wherein X is a hydrogen atom, a halogen atom or an alkyl or alkoxy group each having 1 to 4 carbon atoms to obtain a polyamine, reacting the polyamine with maleic anhydride to obtain a polyamide acid, and dehydration-cyclizing the polyamide acid to obtain a polymaleimide.

Process for producing polymaleimide

1. An epoxy resin composition is described, comprising

Epoxy resin composition

A curable epoxy resin composition of substantially improved curing time and high temperature properties comprising a polyepoxide of the formula: ##STR1## wherein R is H or an alkyl of up to about 18 carbon atoms, X is H or halogen, Y is an alkyl of up to about 18 carbon atoms or methoxy, Z' is H or CH.sub.3, m is an integer of not less than 1, n is an integer of up to 2, and from about 25 to about 120 parts by weight, per 100 parts by weight of the polyepoxide, of an epoxy resin hardener.

Process for preparing a polyepoxide and composition therefrom

An epoxy resin curing agent comprising a compound represented by the formula (I): ##STR1## wherein k, m and n, which may be the same or different, each is an integer of 1 to 6, and l is an integer of 0 to 6, and/or a modified product thereof, a curable epoxy resin composition comprising an epoxy resin and the epoxy resin curing agent represented by the formula (I), and a cured product obtained from the epoxy resin composition.

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Ibaraki, Japan

Kaoru Kanayama