Lg Display Co., Ltd.

Toppan Inc.

Toppan Printing Co., Ltd.

Kaoru Furuta

Miki Fukugami

Takeshi Nishikawa

Masashi Kawashita

Ayumi Tanaka

Hiroyuki Michi

Mikinori Yamada

A gas barrier laminate including: a substrate layer which contains a polyolefin resin; a barrier layer; and an overcoat layer which contains a polyvinyl alcohol resin, the overcoat layer having a surface which has a surface hardness of 1.5 GPa or less, as measured by a nanoindentation method.

Gas barrier laminate and packaging material

A gas barrier film including: a substrate layer containing polypropylene; a resin layer containing a copolymer of propylene and another monomer; a vapor deposition layer of an inorganic oxide; and a gas barrier layer, laminated in this order, wherein the vapor deposition layer has a thickness of 5 nm to 300 nm, the resin layer has a thickness of 0.3 μm or more, and a surface of the resin layer facing the vapor deposition layer has at least one softening temperature in a range of 100° C. to 170° C. when measured by local thermal analysis (LTA).

Gas barrier film

A color developing structure that exhibits good color development and ensures a desired transmittance while diffusing reflected light in multiple directions. A color developing structure includes a concave-convex layer in which a first surface has a concave-convex structure, and a reflective layer formed on the first surface to extend along the concave-convex structure. A convex surface of the concave-convex structure has a first pattern composed of a plurality of strip portions in plan view. The strip portion has a width in a first direction and a length in a second direction perpendicular to the first direction. The width is smaller than the wavelength of the incident light, and a standard deviation of the lengths of the plurality of strip portions is larger than a standard deviation of the widths.

Color developing structure having concave-convex layer, method for producing such structure, and display

A display device, a display system, and a method of installing an electronic component are disclosed. In one embodiment, the electronic component is junctioned to a display panel of the display device using an auto-agglutination solder. The installation method includes positioning the electronic component having an electronic component side line connection part at a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder.

Method of installing electronic component, display device and display system

A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

Growing community of inventors

Tokyo, Japan

Kaoru Furuta