Hitachi-high-technologies Corporation

Hitachi High-tech Corporation

Kaoru Fukaya

Hiroyuki Shindo

Ryugo Kagetani

Hiroyuki Sindo

An object of the disclosure is to provide a pattern inspection and measurement apparatus that can accurately specify a corner point formed on a sample. The pattern inspection and measurement apparatus according to the disclosure specifies a pair of corner points as a corner pair candidate on design data, and specifies a corner point on an actually formed shape pattern in accordance with a relative relation between the corner pair candidate on the design data and the corner pair candidate in the shape pattern (see FIG.).

Pattern inspection/measurement device, and pattern inspection/measurement program

An object of the present invention is to provide an evaluation condition setting method and an evaluation condition setting apparatus of a semiconductor device which can select an appropriate evaluation pattern for exposure condition management with high accuracy. In order to solve the object, the present invention proposes an evaluation condition setting method or an evaluation condition setting apparatus which excludes a pattern corresponding to a process window chart defining a process window range smaller than a predetermined process window range from a measurement target, in a plurality of the process window charts which are obtained based on scanning of a charged particle beam with respect to another pattern formed on a sample.

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Tokyo, Japan

Kaoru Fukaya