Tokyo Electron Limited

Taisei Corporation

Kaoru Fujihara

Akitake Tamura

Teruyuki Hayashi

Tsuyoshi Moriya

Sadao Kobayashi

Hiroshi Nagaike

Misako Saito

Osamu Suenaga

Motohiro Kuji

Kazuo Yamamoto

A particulate measurement device includes: a nozzle which discharges liquid from an opening to form a flow of the liquid; a light emitter which emits light such that the light propagates in a region where the flow of the liquid is formed; a photodetector provided outside the region to receive the light from a partial region extending along a longitudinal direction of the region; and an air flow forming unit which forms a flow of gas along a direction in which the liquid flows, on an outer periphery of the region.

Particulate measurement device

A virus detection device includes a diffusion unit configured to diffuse a virus in a gas as an inspection target into an aqueous solution containing a fluorescent antibody specifically adsorptive to the virus by bringing the gas into contact with the aqueous solution and configured to adsorb the fluorescent antibody to the virus in the gas; an atomization unit configured to atomize the aqueous solution and generate a mist group of the aqueous solution in which the gas is diffused; a fluorescence measuring unit configured to measure a fluorescence intensity of the mist group; and an air current generator configured to form an air current flowing toward the fluorescence measuring unit from the atomization unit.

Virus detection device and virus detection method

In order to prevent particles within a unit from sticking to a substrate in a substrate processing process, an ion generator charges the particles. At the same time, a direct current voltage of the same polarity as the charged polarity of the particles is applied from a direct current power source to the substrate. In order to prevent generation of particles when producing gas plasma, a high-frequency voltage is applied to the upper and lower electrodes at multiple stages to produce plasma. In other words, at a first step, a minimum high-frequency voltage at which plasma can be ignited is applied to the upper and lower electrodes, thereby producing a minimum plasma. Thereafter, the applied voltage is increased in stages to produce predetermined plasma.

Particle sticking prevention apparatus and plasma processing apparatus

A pattern forming method includes (a) forming pairs of deposits on sidewalls of mask portions in first mask patterns by forming a thin film thereon, etching it to leave deposits, and exposing a top surface of a second-layer film between the deposits; (b) forming second mask patterns formed of mask portions corresponding to the deposits by removing the mask portion, plasma etching the second-layer film, and removing the deposits; (c) forming a thin film thereon, and etching it to leave deposits on sidewalls of mask portions facing each other and to expose a third-layer film between the deposits while leaving deposits between adjacent mask portions; and (d) forming grooves thereon by removing the second mask portion, and etching off the third-layer film.

Pattern forming method, semiconductor device manufacturing apparatus and storage medium

The present invention relates to a particle measuring method for irradiating light to a surface of a substrate to scatter the light so as to measure a condition of particles on the substrate based on the scattered light. The particle measuring method according to the present invention comprises the steps of: heating a certain liquid to obtain a steam; supplying the steam onto a substrate so that a content of the steam is absorbed by each particle, while a temperature of the substrate is maintained in such a manner that the steam does not condense on the substrate; cooling the substrate before the particle dries so that the content absorbed by the particle is solidified, while preventing generation of solidified substance on regions of the surface of the substrate to which no particle adheres; and irradiating light to the substrate to scatter the light and detecting the scattered light, under a condition in which the content absorbed by the particle has been solidified.

Particle measuring method and particle measuring apparatus

A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.

Semiconductor manufacturing facility and a semiconductor manufacturing method

An electrical inspecting apparatus includes an apparatus body having a housing section for housing a cassette in which a plurality of wafers are housed, an inspecting section provided with probes for applying an electrical inspection to the wafer, and a transfer section provided with a transfer arm for transferring the wafer between the housing section and the inspecting section. The housing section, inspecting section and transfer section are arranged side by side within the apparatus body, fan filters are mounted on the apparatus body for blowing air in a lateral direction through the housing section, inspecting section and transfer section, and an exhaust duct is mounted on the apparatus body for discharging the air flowing through the sections to the outside of the apparatus body.

Growing community of inventors

Nirasaki, Japan

Kaoru Fujihara