Toyo Ink Mfg. Co., Ltd.

Toyo Ink Sc Holdings Co., Ltd.

Toyochem Co., Ltd.

Kaori Sakaguchi

Kinya Shiraishi

Hidenobu Kobayashi

Naohiro Tanaka

Toshiichi Sawaguchi

Kenji Andou

Takahiro Matsuzawa

Atsushi Nakazato

Daisuke Kishi

Takanori Itoh

Taiki Sakamoto

The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200&#xb0; C. is 10,000-150,000 Pa&#xb7;s, a ratio (&#x3b1;/&#x3b2;) of the maximum value (&#x3b1;) to the minimum value (&#x3b2;) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1&#xd7;100.

Thermally conductive insulating sheet, and composite member

A composite member (1) satisfies the following expressions. X/(E&#xd7;|CTE(B)&#x2212;CTE(A)|)&#x2265;50, X/(E&#xd7;|CTE(B)&#x2212;CTE(C)|)&#x2265;50, Y/|CTE(B)&#x2212;CTE(A)|&#xd7;L(BA)&#x2264;50, and Y/|CTE(B)&#x2212;CTE(C)|&#xd7;L(BC)&#x2265;50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (&#xb0; C.) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (&#xb0; C.) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (&#xb0; C.) of the material of the surface of the heat generating member in contact with the thermoconductive insulating adhesive film, L(BA): initial contact length (m) between the thermoconductive insulating adhesive film and the heat dissipating base substrate, and L(BC): initial contact length (m) between the thermoconductive insulating adhesive film and the heat generating member.

Composite member

An object of the present invention is to provide a thermal conductivity-giving material capable of giving substantially the same level of a thermal conductivity as that of the conventional material by using a smaller amount thereof than that conventionally used or giving a higher thermal conductivity than that of the conventional material by using substantially the same amount thereof as that conventionally used. The aforementioned problem can be solved by an easily deformable aggregate (D) comprising 100 pts&#xb7;mass of thermally conductive particles (A) having an average primary particle diameter of 0.1 to 10 &#x3bc;m, and 0.1 to 30 pts&#xb7;mass of an organic binding agent (B), in which the easily deformable aggregate (D) has an average particle diameter of 2 to 100 &#x3bc;m, and an average compressive force required for a 10% compressive deformation rate is 5 mN or lower.

Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet

Disclosed is a method for producing a metal particle dispersion wherein a metal compound is reduced by using carbodihydrazide represented by the formula (1) below or a polybasic acid polyhydrazide represented by the formula (2) below (wherein R represents an n-valent polybasic acid residue) in a liquid medium. By reducing the metal compound in the presence of a compound having a function preventing discoloration of the metal, there can be obtained a metal particle dispersion having excellent discoloration preventing properties. Metal particles produced by such methods have a uniform particle diameter and are excellent in dispersion stability. By using a conductive resin composition or conductive ink containing a metal particle dispersion obtained by such production methods, there can be formed a conductive coating film, such as a conductive circuit or an electromagnetic layer, having good characteristics. 

Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film

A conductive coating film is formed on a substrate by bringing a conductive material covered with a protective material into contact with a material having anion exchange ability, through such a process wherein an anion exchange layer containing a material having anion exchange ability is formed on a substrate and then a layer containing a conductive material covered with a protective material is formed on the anion exchange layer, or alternatively through such a process wherein a layer containing a conductive material covered with a protective material is formed on a substrate and then an anion exchange layer containing a material having anion exchange ability is formed on the layer containing a conductive material. The anion exchange layer and the layer containing a conductive material may be formed by coating, printing or the like. By using this method, a conductive coating film having excellent adhesion to a substrate can be formed on an ordinary paper substrate, plastic substrate and glass substrate at low temperature in short time.

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Tokyo, Japan

Kaori Sakaguchi