Senju Metal Industry Co., Ltd.

Kanta Dei

Takashi Saito

Shunsaku Yoshikawa

Yuuki Iijima

Takahiro Matsufuji

Hiroshi Okada

Takahiro Yokoyama

Hikaru Nomura

Naoko Izumita

Masato Tsuchiya

Naoto Kameda

Toru Hayashida

Yuki Iijima

Shigeto Suzuki

Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Solder alloy, solder ball, and solder joint

Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition consisting of, by mass %, —Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, and Ge: 0.001 to 0.015% with the balance being Sn

Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013≤(Ag+Cu+Ni+Bi)×Ge≤0.027 (1), Sn×Cu×Ni≤5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Lead-free and antimony-free solder alloy, solder ball, and solder joint

A layered bonding materialincludes a base material, a first solder sectionstacked on a first surface of the base material, and a second solder sectionstacked on a second surface of the base material. A coefficient of linear expansion of the base materialis 5.5 to 15.5 ppm/K, the first solder sectionand the second solder sectionare made of lead-free solder, and both of a thickness of the first solder sectionand a thickness of the second solder sectionare 0.05 to 1.0 mm.

Layered bonding material, semiconductor package, and power module

A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.

Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device

Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.

Solder paste

A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)&#x2264;0.945% (relation (1)), (P+Ge)&#x2264;0.15% (relation (2)), 2.0&#x2264;(Cu+5Ni)/(P+Ge)&#x2264;1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

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Tokyo, Japan

Kanta Dei