Toyota Jidosha Kabushiki Kaisha

Honda Motor Co., Ltd.

Toray Industries, Inc.

Subaru Corporation

Suzuki Motor Corporation

Other

Teijin Limited

Kyowa Industrial Co., Ltd.

Mitsubishi Motors Corporation

Dome Co., Ltd.

Aisin Seiki Kabushiki Kaisha

Nagoya University

Kanji Takaoka

Kazuaki Amaoka

Shusuke Sanai

Yukitane Kimoto

Tomoya Yabu

Tsubasa Ono

Munehito Kawakami

Satoshi Hirawaki

Yoshinori Yamamori

Masashi Horikawa

Tomomi Ichida

Hideaki Maeda

Kazuki Baba

Hiroshi Yuchi

Yasuhiro Kira

A molding method and a molding system for improving a molding speed of a resin molded member. In the method, firstly a thermoplastic resin composite material is filled in a metal mold (i.e., at time T), and subsequently a mold-clamping process gets started. As the mold-clamping process progresses, a first decompression circuit starts to decompress an inside of a cavity when the cavity is closed by a sealing member provided on the metal mold. Then, as the mold-clamping process further progresses, the thermoplastic resin composite material thus filled in the metal mold contacts an upper mold of the metal mold (i.e., at time T). After that, a second decompression circuit starts to decompress the inside of the cavity, thereby to complete the mold-clamping process (i.e., at time T).

Molding method and molding system for resin molded member

To provide a vehicle floor panel having a certain rigidity and being less prone to deformation during manufacturing and deformation when the vehicle floor panel installed in a vehicle is subjected to loads in various directions from outside the vehicle. A vehicle floor panel includes a floor panel main body made of a fiber-reinforced resin, a plurality of recesses-to-protruding on one of a lower surfaceand upper surface of the floor panel main body and depressed on the other of the surfaces and arranged by being spaced apart from one another, and ribs-to-connecting two adjacent ones of the recesses on the one of the surfaces of the floor panel main body.

Vehicle floor panel

A silicoaluminophosphate molecular sieve being represented by the compositional formula (SiAlPM)Owhere M is magnesium, a is 0.05 to 0.17, b is 0.45 to 0.55, c is 0.33 to 0.45, d is 0.001 to 0.030, and a+b+c+d=1, and an average primary particle size of 60 nm or less. A method of producing the silicoaluminophosphate molecular sieve includes carrying out a hydrothermal treatment on a mixture that contains a silicon source, an aluminum source, a phosphorus source, a structure-directing agent, and at least one of an inorganic magnesium salt or an organic magnesium salt or an inorganic manganese salt or an organic manganese salt at 0.001 to 0.1 mole per mole of the aluminum source.

Silicoaluminophoshphate molecular sieve and method of producing same

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Aichi, Japan

Kanji Takaoka