Kaneka Corporation

Kanji Shimoosako

Shigeru Tanaka

Mutsuaki Murakami

Takashi Ito

Masaru Nishinaka

Kentaro Tsukuya

Hitoshi Yasuhira

Konoshin Fujimoto

The laminate includes a multilayer polyimide film having thermoplastic polyimide layers on both sides of a core layer which is a non-thermoplastic polyimide film and a surface layer contacting the thermoplastic polyimide layer on one surface-side of the multilayer polyimide film. The surface layer may be an inorganic layer having a thickness of 1 to 200 nm or a resin layer having a thickness of 0.1 to 5 μm. A single-sided metal-clad laminate is formed by laminating a metal layer on the thermoplastic resin layer on the surface layer non-formed surface of the laminate.

Laminate, single-sided metal-clad laminated sheet, and multi-layer printed wiring board

A laminate of the present invention comprises a plating-target material including a layer-A, that is subjected to electroless copper plating and has a surface roughness such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 &#x3bc;m. The 90&#xb0; anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin having a siloxane structure formed by polymerizing a diamine component having a structure represented by Formula (6) in a content of 5 to 95 mol % based on the entire diamine component. A sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface. Accordingly, the plating-target material and laminate of the present invention is suitably applicable to manufacturing of a printed-wiring board and the like.

Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them

It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 &#x3bc;m or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.

Solution, component for plating, insulating sheet, laminate, and printed circuit board

A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.

Growing community of inventors

Kyotanabe, Japan

Kanji Shimoosako