Kaneka Corporation

Kanji Shimoohsako

Shigeru Tanaka

Mutsuaki Murakami

Koji Okada

Takashi Itoh

Takashi Ito

The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.

Thermosetting resin composition, multilayer body using same, and circuit board

It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).

Thermosetting resin composition, laminated body using it, and circuit board

Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group. By using such a composition, multilayer bodies and circuit boards with excellent properties can be manufactured.

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Osaka, Japan

Kanji Shimoohsako