Ebara Corporation

Kanji Ohno

Akihisa Hongo

Ryoichi Kimizuka

Mizuki Nagai

Megumi Maruyama

Hiroaki Inoue

Junichiro Yoshioka

Akiji Sekiguchi

A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits () to fill the fine pits with a metal () and includes performing a first plating process () by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process () by immersing the substrate in a second plating solution having a composition superior in leveling ability.

Substrate plating method and apparatus

A method and apparatus for forming interconnects embedding a metal such as copper (Cu) into recesses for interconnects formed on the surface of a substrate such as a semiconductor substrate. The method includes providing a substrate having fine recesses formed in the surface, subjecting the surface of the substrate to plating in a plating liquid, and subjecting the plated film formed on the surface of the substrate to electrolytic etching in an etching liquid.

Apparatus for forming interconnects

A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits ( ) to fill the fine pits with a metal ( ) and includes performing a first plating process ( ) by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process ( ) by immersing the substrate in a second plating solution having a composition superior in leveling ability.

Method for plating a first layer on a substrate and a second layer on the first layer

Method for making alkanol-or alkane-sulfone plumbate

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Kanagawa, Japan

Kanji Ohno