Nitto-Denko Corporation

Kanji Nishida

Atsushi Hino

Kazuo Kitada

Takaichi Amano

Naoyuki Matsuo

Tomokazu Yura

Tomonori Noguchi

Hiromichi Ohashi

Yoshihiro Kameda

Tadayuki Kameyama

Shoichi Matsuda

Youichirou Sugino

Yoshihiro Kitamura

Masakatsu Urairi

Isao Hirose

Yoshiaki Asanoi

Hitoshi Ishizaka

Naoki Tomoguchi

Hiroshi Tomohisa

Kanto Kobayashi

An impact-absorbing pressure-sensitive adhesive sheet according to an embodiment of the present invention includes an impact-absorbing pressure-sensitive adhesive layer including an impact-absorbing layer. A side surface of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65&#xb0; or more.

Impact-absorbing pressure-sensitive adhesive sheet and method of producing the same

There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

Laser processing method and land laser processed product

The present invention provides an optical laminated body having a patterning polarizer layer in which a more complicated pattern can be set. The optical laminated bodyA of the present invention has a patterning polarizer layerA having at least two polarizing regionsA andA having different single transmittances, and a substrateA. The two polarizing regionsA andA are different in thickness.

Optical laminated body and method for production of optical laminated body

An end face of a polarization plate cut by laser becomes a substantially flat surface having only sloping micro waviness because of having been melted once to be solidified. Since the surface has few stress-concentrated parts that may cause microcracks, this prevents microcracks from easily being produced.

Microcrack free polarization plate

A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unitto form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism. The peeling mechanismfeeds a forwardmost one the polarizing films F to a laminating mechanismwhile peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatusin synchronization of the feeding of the forwardmost polarizing film F.

Method and system for laminating optical elements

A first through hole is formed in a laminate by trepanning machining using laser light, for example. The trepanning machining refers to a process for irradiating laser light along such a trajectory that the laser light is first irradiated onto a substantially central area of a first through hole to be formed, the laser light is irradiated along a circumference corresponding to the bore diameter of the first through hole to be formed, and the laser light is finally irradiated onto the substantially central area of the first through hole to be formed again. A second through hole being substantially concentric with and having a larger bore diameter than the first through hole is formed by irradiating the laser light, similarly to the first through hole.

Through hole forming method

An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board

Growing community of inventors

Ibaraki, Japan

Kanji Nishida