Mitsubishi Materials Corporation

Kanji Kuba

Akihiro Masuda

Takuma Katase

Hiroki Muraoka

Sho Nakagawa

Yousuke Kawamura

An object and a problem of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution and excellent in storage stability in the air. The tin(II) oxide powder of the present invention is for replenishing a tin component of a tin-alloy plating solution, and comprises 100 to 5000 ppm of an antioxidant being contained in the powder with a mass ratio, and has such a dissolution rate that when 0.1 g of the tin(II) oxide powder is added to 100 ml of 100 g/L aqueous alkylsulfonic acid solution at a temperature of 25&#xb0; C. and stirred, then the powder dissolves therein within 180 seconds.

Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powder

An object of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution, excellent in storage stability in the air and can heighten oxidation-preventive effect of Snion in the plating solution. The method for manufacturing tin(II) oxide powder of the present invention comprises Step () of preparing an aqueous acidic solution containing Snions, Step () of neutralizing the aqueous acidic solution by adding an aqueous alkaline solution to prepare a slurry of tin(II) hydroxide, Step () of dehydrating the prepared slurry to obtain a slurry of tin(II) oxide, Step () of separating the slurry of tin(II) oxide into a solid and a liquid to obtain tin(II) oxide, Step () of treating the obtained tin(II) oxide with an aqueous antioxidant solution, and Step () of vacuum drying the tin(II) oxide treated with the aqueous antioxidant solution.

Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said method

In solder powder having an average particle size of 5 &#x3bc;m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.

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Iwaki, Japan

Kanji Kuba