Tdk Corporation

Toyota Boshoku Kabushiki Kaisha

Riken Technos Corporation

Kanji Kobayashi

Masao Yamaguchi

Shinya Yoshihara

Jun Kudo

Toshio Kubota

Koji Mishima

Nozomu Washio

Kenji Okamoto

Shouhei Harada

Masahiro Irie

Takamitsu Kamimura

Kazushi Yamada

A light control film to be bonded to a panel member for a vehicle includes film substrates, conductive layers, and a liquid crystal layer. The conductive layers are on surfaces of the film substrates opposed to each other, respectively. The liquid crystal layer is sandwiched between conductive layers. The light control film is switchable between a first state with a first haze percentage and a second state with a second haze percentage that is lower than the first haze percentage. Each film substrate includes at least an acrylic imide layer made of acrylic imide. Each conductive layer includes a thin silver film or a copper wire mesh.

Light control film and vehicle body panel including the same

Slider processing apparatus, load applying apparatus and auxiliary device for processing slider

It is an object of the invention to prevent a lapping member from being cut by an edge of a slider when the edge is chamfered by lapping it with the lapping member. A slider held by a slider holding jig according to the invention is put in contact with a diamond lapping sheet. A load applying portion moves weights provided in the form of a plurality of stages downward from a state in which the lower end of a shaft portion of the weight at the bottom stage is located above the slider holding jig without contacting the slider holding jig, thereby loading the slider holding jig with the weights sequentially from the bottom stage.

Apparatus and method for processing slider, load applying apparatus and auxiliary device for processing slider

For cleaning a wafer by a cleaning apparatus, a cleaning liquid is contained in a cleaning bath. Leaving two brushes open, the wafer is inserted to the cleaning bath, placed on oscillation and rotation rollers and retained by the rollers. The brushes are closed and the wafer is held by the brushes. Next, the two brushes are rotated while the wafer is oscillated and rotated by the rollers and so on. Furthermore, ultrasonic vibrations are applied to the cleaning liquid in the cleaning bath by an ultrasonic generator. Scrub cleaning with the two brushes and ultrasonic cleaning by ultrasonic vibrations are thereby performed on the wafer.

Cleaning method

Cleaning apparatus

A cleaning apparatus includes a cleaning tank for reserving cleaning fluid, an object to be cleaned being immersed in the cleaning fluid, a vibrator for vibrating the cleaning fluid in the cleaning tank, and two micro-vibration sources for minutely vibrating the object to be cleaned in two different directions.

Cleaning apparatus and method

A method and an apparatus are provided for processing a slider having a rail forming part of a medium facing surface of the slider which faces a medium, at least part of an outer side of the rail being located inside a side of the slider. The slider includes at least first edges each between the medium facing surface of the rail and the outer side of the rail and a second edge located closer to the side of the slider than the first edges. At least the first edges and the second edge are removed.

Slider processing method and apparatus

A slider has a rail with a medium facing surface. At least part of a lateral wall of the rail is located closer to a center of the slider than a lateral wall of the slider. First edges between the medium facing surface of each of the rails and the lateral wall of the rail and a second edge between the lateral wall of the slider and the medium facing surface are each blunt.

Slider with blunt edges

At the time of polishing an air bearing surface 12 the edge of the air bearing surface 12 is simultaneously beveled to form edge surfaces 14. The air bearing surface 12 is preferably constituted as a flat planar surface 121 having a tapered surface 122 continuous therewith at the air inflow end. In this case, defining the bevel width in regions IV located at the edge surfaces 14 at opposite sides in a direction perpendicular to the air inflow direction and extending in the vicinity of a ridge portion 131 between the central flat planar surface 121 and the tapered inflow end surface 122 and the bevel width in regions II located ahead of an interface 171 between the slider 1 and a thin-film transducer element 17 as I.sub.4 and I.sub.2 respectively, the bevel width of an air inflow end edge surface 14 (region V) continuous with the tapered inflow end surface 122 as I.sub.5 and the bevel width of opposite side edge surfaces 14 (region III) continuous with the central flat planar surface 121 as I.sub.3, (I.sub.4 -I.sub.5)/I.sub.5 is restricted to not more than 0.4, (I.sub.3 -I.sub.2)/I.sub.3 is restricted to not more than 0.2, the bevel width of all edge surfaces 14 is restricted to 4-20 .mu.m, or the bevel width range R thereof is restricted to not more than 5 .mu.m. By in this way restricting the bevel width of the edge surfaces 14 over the entire perimeter of the air bearing surface 12 so as to be highly uniform, there are realized marked improvements in flying stability, particularly a reduction in the variation in roll angle in the flying attitude.

Growing community of inventors

Saku, Japan

Kanji Kobayashi