Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Boe Mled Technology Co., Ltd.

Kangle Chang

Lu Yu

Jian Sang

Heling Zhu

Pengfei Cheng

Jingfu Tao

Yinwei Chen

Haiwei Sun

Pei Li

Jinpeng Li

Shubai Zhang

Jingang Liu

Chuandong Liao

Shuo Wang

Ming Zhai

Yutao Hao

Yali Zhang

Pengjun Cao

Pei Qin

Zewen Gao

Xin Li

Ming Jin Chen

Jinzhao Zhou

A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Backplane and method for manufacturing the same, and display device

A texture recognition device and a display device are provided. The texture recognition device includes a backlight element, configured to provide first backlight; a light constraint element, configured to perform a light divergence angle constraint process on the first backlight to obtain second backlight with a divergence angle within a preset angle range, the second backlight being transmitted to a detection object; and a photosensitive element, configured to detect the second backlight reflected by a texture of the detection object to recognize a texture image of the texture of the detection object.

Texture recognition device and display device

A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Display substrate and method of manufacturing the same, and display device

The present disclosure provides an optical adjusting film, a backlight module and a display device. The optical adjusting film according to the present disclosure includes a first substrate and a second substrate opposite to each other; a first electrode layer on a side of the first substrate facing the second substrate; a second electrode layer on a side of the second substrate facing the first substrate; a polymer dispersed liquid crystal layer between the first electrode layer and the second electrode layer; and an anti-adsorption surface layer on a side of the first substrate away from the second substrate, and/or a side of the second substrate away from the first substrate, and configured to suppress adsorption between the optical adjusting film and a solid surface.

Optical adjusting film, backlight module and display device

A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

A side-type backlight module includes a light guide plate and a reverse prism sheet that are stacked. The reverse prism sheet includes a first prism. A surface of the first prism proximate to the light guide plate includes a plurality of prism structures substantially parallel to each other. Each prism structure protrudes toward a direction approaching the light guide plate. A surface of the light guide plate proximate to the reverse prism sheet includes a plurality of strip-shaped microstructures substantially parallel to each other. Each strip-shaped microstructure protrudes toward a direction approaching the reverse prism sheet. An extending direction of the prism structure crosses an extending direction of the strip-shaped microstructure.

Side-type backlight module and liquid crystal display apparatus

An anti-peeping module provided by an embodiment of the application includes a plurality of light transmitting films, each including at least two light transmitting sub-films having different refractive indexes which are disposed in a laminated manner, and a first optical path modulating layer on one side of the plurality of light transmitting films, the first optical path modulating layer comprising a plurality of zigzag structures, the and being configured to allow light entering into the plurality of light transmitting films at a Brewster incident angle to exit from the anti-peeping module in a travelling direction perpendicular to a plane where the anti-peeping module is located.

Anti-peeping module and display device

The present disclosure discloses a fingerprint identification method and apparatus, an electronic device, and a computer-readable storage medium. The fingerprint identification method includes: acquiring a touch position of an object on a display panel comprising a backlight module having a plurality of light emitting elements arranged into an array, in response to the object on the display panel; lighting at least one of the plurality of light emitting elements according to the touch position; collecting fingerprint information from the display panel, wherein the fingerprint information is obtained based on light which is emitted by the at least one lit light emitting element and is reflected by the object; and performing fingerprint identification according to the fingerprint information.

Fingerprint identification method and apparatus, electronic device, and computer-readable storage medium

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Beijing, China

Kangle Chang