Samsung Electro-mechanics Co., Ltd.

Kangha Lee

Yoona Park

Jinsoo Park

Chul Seung Lee

Jong Ho Lee

Myung Jun Park

Wookyung Sung

Jin Hyung Lim

SoEun Choi

So Eun Choi

Eun Byeol Choi

Jung Min Kim

Hye Young Choi

Ji Hye Han

Eui Hyun Jo

Jin Soo Park

Jun Hyeong Kim

Yeon Song Kang

Sin Il Gu

Ha Jeong Kim

BeomSuk Kang

Eun-Jin Kim

Dong Ha Kang

Eunme Park

An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.

Multilayer electronic component

A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.

In an embodiment of the present disclosure, among a plurality of crystal grains included in first electrode layers, crystal grains disposed on an end of the dielectric layer in the second direction and in contact with the second electrode layers are defined as first crystal grains and crystal grains disposed on ends of the internal electrodes in the second direction and in contact with the second electrode layers are defined as second crystal grains, and a growth direction of the first crystal grains and a growth direction of the second crystal grains may be adjusted, so that bonding force between the first electrode layers and the body may be improved.

A multilayer electronic component, may include: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other, the first surface including first and second band electrodes disposed to be spaced apart from each other; a first external electrode disposed on the third surface and connected to the first internal electrode and the first band electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second band electrode; a first plating layer disposed on the first external electrode and the first band electrode; and a second plating layer disposed on the second external electrode and the second band electrode.

A multilayer electronic component includes a body including first and second surfaces opposing each other in the first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, a first external electrode including a first base electrode layer including glass and Ni and disposed on the third surface, a first intermediate electrode layer including an alloy containing Sn and Ni and disposed on the first base electrode layer, and a first conductive resin layer including a resin and a metal and disposed on the first intermediate electrode layer and extending to the first and second surfaces, a second external electrode including a second base electrode layer disposed on the fourth surface, a second intermediate electrode layer disposed on the second base electrode layer, and a second conductive resin layer disposed on the second intermediate electrode layer.

Multilayer electronic component and method of manufacturing the same

A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a corner of the body and connected to the base electrode layer, a conductive resin layer disposed on the intermediate electrode layer, and a plating layer disposed on the conductive resin layer. The intermediate electrode layer may be in contact with the plating layer on the corner of the body to prevent an increase in ESR while preventing cracks due to mounting through the conductive resin layer.

A multilayer capacitor includes a capacitor body including an active region having a dielectric layer, and first and second internal electrodes, and an upper cover region and a lower cover region respectively disposed above and below the active region, and including first to sixth surfaces; and first and second external electrodes disposed on both end portions of the capacitor body in the second direction, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes include first and second conductive layers disposed on the third and fourth surfaces, respectively; first and second conductive resin layers disposed on the first and second conductive layers, respectively; and first and second plating layers disposed on the first and second conductive resin layers, respectively, and contacting the first and second conductive layers in the upper or lower cover region, respectively.

Multilayer capacitor

A multilayer electronic component includes a body including a plurality of dielectric layers and first and second internal electrodes disposed alternately with the dielectric layers in a first direction; a first external electrode including a first connection electrode, disposed on the third surface, and a first band electrode disposed on the first surface to be connected to the first connection electrode; a second external electrode including a second connection electrode, disposed on the fourth surface, and a second band electrode disposed on the first surface to be connected to the second connection electrode; a first insulating layer disposed on the first connection electrode; a second insulating layer disposed on the second connection electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode, The first and second band electrodes include a conductive metal and a resin.

An electronic component includes: a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a connection portion on the third surface, and first and third band portions respectively on the first and second surfaces; a second external electrode including a connection portion on the fourth surface, and second and fourth band portions respectively on the first and second surfaces; an insulating layer disposed on the connection portions, and covering the second surface and the third and fourth band portions; plating layers respectively disposed on the first and second band portions; and first and second additional electrode layers respectively disposed between the connection portion and the third surface and between the connection portion and the fourth surface. The first or second external electrode includes copper. The first or second additional electrode layer includes one of nickel and an alloy of nickel.

A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).

Growing community of inventors

Suwon-si, South Korea

Kangha Lee