Qualcomm Incorporated

Henkel Corporation

H.b. Fuller Licensing & Financing Inc.

Loctite Corporation

Jiaxing Modu New Energy Co., Ltd

Kang Yang

Shrenik Patel

Puwei Liu

Vasanthan Raghavan

Stephen M Dershem

Michelle B Acquaye

Sony Akkarakaran

Li Liu

Chuan Wang

David B Malcolm

John M Zimmel

Kevin J Reid

James T Huneke

Qing Ji

Benedicto Delos Santos

Junyi Li

Alexei Yurievitch Gorokhov

Jung Ho Ryu

Heechoon Lee

Raghu Narayan Challa

Abdellatif Bellaouar

Bhushan Shanti Asuri

Yongle Wu

Jong Hyeon Park

Rajagopalan Rangarajan

Scott Hoover

Vinod Panikkath

Kevin Hsi-Huai Wang

Yunfei Feng

Wu-Hsin Chen

Bo Wang

Damin Cao

Mingxia Cheng

Antriksh Pany

Merilee M Reski

Carolyn C Albino

Lingyun Huang

Xiaohong Zhang

Yann-Cheng Lin

A radio system architecture includes a receiver having multiple sub arrays in a phased array, the multiple sub arrays configured to perform carrier aggregation (CA) and multiple input multiple output (MIMO) signal processing, and provide independent beam management for multiple radio frequency (RF) signals received at each of the multiple sub arrays, and a data processor configured to receive signals from the receiver and extract information regarding wireless communications.

Phased array antenna architecture

Methods, systems, and devices for wireless communication are described. In some systems, a user equipment (UE) may transmit, to a network entity, a first signal including a request to update a resolution of a phase shifting operation associated with beam-based communications. The UE may receive, from the network entity, a second signal approving the request. The UE may communicate using a beam according to an updated resolution of the phase shifting operation based on the second signal approving the request. Additionally, or alternatively, the UE may transmit a first signal including a request to suspend a beam refinement process based on the resolution of the phase shifting operation. The UE may receive a second signal approving the request to suspend the beam refinement process. The UE may communicate with the network entity using a beam based on suspending further beam refinement in response to the second signal.

Techniques for managing low or variable phase shift resolutions in beam-based communications

Methods, systems, and devices for wireless communications are described. A first wireless device may transmit, to a second wireless device, capability control signaling indicating a first quantity of beam switches is supported within a first time period for a first antenna subarray, a first antenna module, or both, of the first wireless device. The first wireless device may receive from the second wireless device in accordance with the capability control signaling, a grant scheduling one or more messages and indicating a set of beams of the first wireless device over which to communicate the one or more messages in respective transmission time intervals (TTIs) of the first time period. The first wireless device may then transmit or receive, over the first time period using the first antenna subarray, the first antenna module, or both, the one or more messages using the set of beams.

Techniques for indicating beam switching capability

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a base station, configuration information indicating a set of component carriers (CCs) associated with the UE. The UE may receive, from the base station, a message that activates or deactivates one or more CCs of the set of CCs. The UE may communicate, with the base station, after receiving the message, using one or more activated CCs of the set of CCs over a tuned radio frequency (RF) bandwidth that is based on receiving the message and based on the one or more activated CCs. Numerous other aspects are provided.

Optimized component carrier activation and deactivation

The present invention relates to a parallel electrical connection structure for battery poles, a parallel battery bank, a battery pack, and a manufacturing method thereof. The parallel electrical connection structure mainly comprises a common adjusting busway and a plurality of electrically connecting branches, the two ends of each of the electrically connecting branches are configured to be electrically connected to the poles of the same polarity of the plurality of individual batteries and the common adjusting busway, the poles of the same polarity of different individual batteries are connected in shunt via the common adjusting busway and the electrically connecting branches, and the current carrying capacity of each electrically connecting branch is smaller than that of the common adjusting busway. With the present invention, any battery with thermal runaway in a new energy battery pack can be discovered and isolated as early as possible, and the development of the thermal runaway in the battery can be blocked as soon as possible, to avoid negative effects of the battery with thermal runaway on other normal batteries in the battery pack and ensure the normal operation of the battery pack.

Parallel electrical connection structure for battery poles, a parallel battery bank, a battery pack, and a manufacturing method thereof

Methods, systems, and devices for wireless communications are described. A communications device may transmit, to a second communications, a request to update a phase shifter configuration. The first communications device may receive, from the second communications device and in response to the request, a response accepting the request to update the phase shifter configuration. The first communications device may then transmit, to the second communications device, an uplink transmission in accordance with the updated phase shifter configuration based on receiving the response. The first communications device may include a first user equipment (UE) and the second communications device may include a second UE or a base station.

Techniques for enabling power savings with phase shifter configurations

Methods, systems, and devices for wireless communications are described. A first wireless device may transmit, to a second wireless device, capability control signaling indicating a first quantity of beam switches is supported within a first time period for a first antenna subarray, a first antenna module, or both, of the first wireless device. The first wireless device may receive, from the second wireless device in accordance with the capability control signaling, a grant scheduling one or more messages and indicating a set of beams of the first wireless device over which to communicate the one or more messages in respective transmission time intervals (TTIs) of the first time period. The first wireless device may then transmit or receive, over the first time period using the first antenna subarray, the first antenna module, or both, the one or more messages using the set of beams.

An apparatus is disclosed for transceiving signals in multiple modes. In example implementations, an apparatus includes a transceiver that includes a first amplifier; a mixer having at least one input node and at least one output node, with the at least one input node coupled to the first amplifier; and a second amplifier coupled to the at least one output node of the mixer. The transceiver also includes a first register coupled to the first amplifier and a second register coupled to the second amplifier. The transceiver further includes at least one memory realizing a lookup table. The at least one memory is coupled to the first register and the second register. The lookup table includes a first portion corresponding to a first mode of the transceiver and a second portion corresponding to a second mode of the transceiver.

Multimode transceiving

The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Interlayer dielectric and pre-applied die attach adhesive materials

The present invention provides a thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixture of one or more maleimide, nadimide, or itaconimide containing resins, a comonomer and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper, and optionally an organic solvent.

Conductive ink compositions

In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

Low shrinkage thermosetting resin compositions and methods of use therefor

In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.

Film adhesives containing maleimide compounds and methods for use thereof

Low shrinkage thermosetting resin compositions and methods of use thereof

Reactive hot melt polyurethane adhesives are useful in the graphic arts area, and in particular, for bookbinding applications such as casemaking, casing-in, gluing-off or thread-securing, facing, slip cases, lining-up, tightbacking, and bonding sides and joints; and for puzzle and gameboard lamination.

Bookbinding case-making applications utilizing polyurethanes

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San Diego, CA, United States of America

Kang Yang