Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Kang Wook Lee

Gu S Kim

Dong Hyeon Jang

Seung Duk Baek

Jae Sik Chung

An inspection system for a vehicle underbody in an in-line process includes: a vehicle recognition unit for acquiring a vehicle ID by recognizing a vehicle entering an inspection process; a vision system that photographs the vehicle underbody through a plurality of cameras disposed under a vehicle moving direction (Y-axis) and disposed at vertical and diagonal angles along a width direction (X-axis) of the vehicle; and an inspection server that detects assembly defects of a component by performing at least one of a first vision inspection that matches an object image for each component through a rule-based algorithm or a secondary deep-learning inspection through a deep-learning engine by acquiring a vehicle underbody image photographed by operating the vision system with setting information suitable for a vehicle type and a specification according to the vehicle ID.

Inspection system and method for vehicle underbody

An electronic module comprises a monolithic microelectronic substrate including at least one integrated circuit die, e.g., a plurality of unseparated memory dice or a mixture of different types of integrated circuit dice. The monolithic substrate further includes a redistribution structure disposed on the at least one integrated circuit die and providing a connector contact coupled to the at least one integrated circuit die. For example, the connector contact may be configured as edge connector contact for the module. The redistribution structure may be configured to provide a passive electronic device, e.g., an inductor, capacitor and/or resistor, electrically coupled to the at least one integrated circuit die and/or the redistribution structure may comprise at least one conductive layer configured to provide electrical connection to a contact pad of an electronic device mounted on the substrate. Methods of fabricating electronic modules are also discussed.

Wafer-level electronic modules with integral connector contacts

Growing community of inventors

Gyeonggi-do, South Korea

Kang Wook Lee