International Business Machines Corporation

Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Globalfoundries U.S. 2 LLC

Kang-Won Lee

Dinesh C Verma

Ramya Raghavendra

Bong Jun Ko

Seraphin Bernard Calo

Vasileios Pappas

Raheleh B Dilmaghani

Dakshi Agrawal

Yang Song

Kaladhar Voruganti

Sandeep Gopisetty

Ho Yin Starsky Wong

Parul Gupta

Ramani Ranjan Routray

Ravindranath Kokku

Murtaza Zafer

Vinay Kumar Kolar

Theodoros Salonidis

Shivkumar Kalyanaraman

Petros Zerfos

Ting He

Gregory E McBride

Murthy V Devarakonda

Robert Beverley Basham

David Michael Shackelford

Won-ki Hong

Chatschik Bisdikian

Norbert George Vogl

Seung-Ho Nam

Brent William Yardley

Chung-hao Tan

Khalid Filali-Adib

David Alson George

Cuong Minh Le

James Mitchell Ratliff

Konstantinos Magoutis

Hee-Woong Park

Jeong-Heon Lee

Gauri Sudhir Shah

Young-Sik Kim

Jian Tan

Choon-Hyop Lee

Dong-Sik Lee

Bongjun Ko

Hyun-Jae Lee

Donghoon Jang

Ji-Hong Park

Moon-Sung Choi

Donnie H Kim

Won-Gu Cho

Jaeyoung Song

Yuting Ji

Sambit Sahu

Robert Bruce Nicholson

Sung-Min Hwang

Qing Fa Wang

Mukesh Kumar Mohania

Erich Miles Nahum

Suresh N Chari

Sumedh Wasudeo Sathaye

Hani Talal Jamjoom

Yonghua Lin

Tae-Hyeog Jung

Ravi Kothari

Peter Hans Westerink

Steve Richard White

Kyu-Young Kim

Sung-Hwan Kim

Anees Abdul Shaikh

James R Giles

Joel W Branch

Pau-Chen Cheng

Maroun Touma

Cesar Augusto Gonzales

Hyung-Chul Kim

Hai Zhan

Byeong-Kyu Jeon

Jorge Lobo

Young-Seok Yoo

Chi-Kin Chau

Vlivek V Shrivastava

Suk-Bok Lee

Joseph D Ryan

Kyoungsoo Park

Jisoo Chung

Ye-Bin Lee

Paul Schmitt

Man-Sik Myeong

In a 3D semiconductor memory device, a stack structure includes electrodes and first insulating layers disposed between the electrodes. The stack structure has a stair structure on a connection region. A vertical channel structure penetrates the stack structure on a cell array region. A vertical dummy structure penates the stair structure on the connection region. A second insulating layer is selectively disposed on the cell array region. A maximum thickness of the second insulating layer ranges from 1.5 times to 10 times a maximum thickness of the first insulating layer on the second insulating layer. The vertical channel structure includes an abrupt diameter change at a level of a top surface of the second insulating layer. The abrupt diameter change has a surface which is parallel to the top surface of the second insulating layer and is substantially coplanar with the top surface of the second insulating layer.

Three-dimensional semiconductor memory devices

A three-dimensional semiconductor memory device includes; a first block and a second block arranged on a first substrate in a first direction, wherein each of the first block and the second block includes electrode layers stacked on the first substrate, a source layer interposed between the first block and the first substrate, and between the second block and the first substrate, a first insulating separation pattern interposed between the first block and the second block and extending in the first direction, wherein the first insulating separation pattern includes a line portion and a protruding portion, the line portion extending in a second direction crossing the first direction, and the protruding portion having a width greater than a width of the line portion, a first source contact plug penetrating the protruding portion of the first insulating separation pattern to electrically connect the source layer, and at least one through via penetrating the source layer and at least one of the first block and the second block.

Three-dimensional semiconductor memory device

A computer-implemented method includes: receiving, using a processor, multiple data session records (DSRs); storing the multiple DSRs in a memory communicatively coupled to the processor; analyzing, using the processor, the stored multiple DSRs for temporal and spatial data; and determining, using the processor, quality degradation by using the temporal and spatial data for the stored multiple DSRs.

Detecting and diagnosing call quality degradation issues using data session record data

A display device includes a first substrate, a flexible printed circuit, and a film. The flexible printed circuit is disposed on a first area of the first substrate. The film is disposed on the first substrate and the flexible printed circuit. The flexible printed circuit includes a second substrate, a pad area, and a dummy pad. The pad area comprises pads disposed on the second substrate. The pads extend in a first direction and are spaced apart from one another in a second direction crossing the first direction. The dummy pad is disposed on the second substrate. The dummy pad is spaced apart from the pad area.

Flexible printed circuit and display device

A flexible touch sensing unit includes a substrate including a plane region and a bending region, a plurality of sensing electrodes disposed on the substrate, a plurality of sensing lines surrounding the plurality of sensing electrodes and electrically connected to the plurality of sensing electrodes, and a damage prevention layer disposed in the bending region. Cracks on the sensing electrodes and the sensing lines which are disposed in the bending region may be prevented by the damage prevention layer in the bending region. A resulting flexible display device using the flexible touch sensing unit may be thinner by omission of a flexibility enhancing layer.

Flexible touch sensing unit and flexible display device including flexible touch sensing unit

A display device including a first film, a flexible printed circuit, and a second film. The first film includes a substrate and a non-adhesive pattern, where the substrate includes a first area and a second area adjacent to the first area, and the non-adhesive pattern is formed on at least a portion of the second area. The flexible printed circuit is disposed on the first area of the first film. The second film is disposed on the flexible printed circuit and the first film.

Touch sensing unit and display device

Embodiments of the present invention may involve a method, system, and computer program product for controlling privacy in a face recognition application. A computer may receive an input including a face recognition query and a digital image of a face. The computer may identify a target user associated with a facial signature in a first database based at least in part on a statistical correlation between a detected facial signature and one or more facial signatures in the first database. The computer may extract a profile of the target user from a second database. The profile of the target user may include one or more privacy preferences. The computer may generate a customized profile of the target user. The customized profile may omit one or more elements of the profile of the target user based on the one or more privacy preferences and/or a current context.

Controlling privacy in a face recognition application

A touch screen panel includes a substrate, sensing electrodes, outer wirings, contact units, and at least one dummy pattern. The substrate includes an active region and a non-active region, the non-active region disposed outside the active region. The sensing electrodes are disposed in the active region. The outer wirings are disposed in the non-active region. Each of the outer wirings is connected to a respective group of the sensing electrodes. The contact units connect the respective groups of sensing electrodes to the outer wirings. The at least one dummy pattern is disposed between adjacent contact units of the contact units.

Touch screen panel including at least one dummy pattern

According to one exemplary embodiment, a method for time-shifted uploading of a data file through a backhaul network to a backend provider is provided. The method may include intercepting an upload request from an originating user located at a network edge. The method may include caching the data file associated with the upload request upstream of the backhaul network. This method may include uploading a placeholder file to the backend provider. The method may include receiving a file ID from the backend provider. The method may include mapping the received file ID to the cached data file. The method may include intercepting a request to access the data file by a requesting user. The method may include sending the requesting user the cached data file. The method may include uploading a copy of the data file to the backend provider based on a backhaul utilization policy.

Local content sharing through edge caching and time-shifted uploads

Various embodiments manage service issues within a wireless communication network. In one embodiment, a one or more call detail records associated with a set of wireless communication devices of a wireless communication network is received. A set of information within each of the one or more call detail records is compared to a baseline statistical model. The baseline statistical model identifies a normal operating state of the wireless communication network. At least one outlier call detail record in the one or more call detail records is identified based on the comparison. The at least one outlier call detail record indicates that at least one wireless communication device associated with the at least one outlier call detail record experienced one or more service issues.

Localizing faults in wireless communication networks

Systems, methods and computer program products for aliasing of named data objects (in named data networks) and entities for named data networks (e.g., named graphs for named data networks). In various examples, aliasing of named data objects may be implemented in one or more named data networks in the form of systems, methods and/or algorithms. In other examples, named graphs may be implemented in one or more named data networks in the form of systems, methods and/or algorithms.

Aliasing of named data objects and named graphs for named data networks

There is provided a method, a system and a computer program product for improving performance and fairness in sharing a cluster of dynamically available computing resources among multiple jobs. The system collects at least one parameter associated with availability of a plurality of computing resources. The system calculates, based on the collected parameter, an effective processing time each computing resource can provide to each job. The system allocates, based on the calculated effective processing time, the computing resources to the multiple jobs, whereby the multiple jobs are completed at a same time or an approximate time.

Scheduling mapreduce jobs in a cluster of dynamically available servers

Various embodiments estimate network load in a wireless communication network. In one embodiment, at least one call detail record associated with a wireless communication network is received. A topology representing the network is analyzed. The topology includes a plurality of nodes each representing a network element within the wireless communication network. The topology also includes a plurality of edges between two or more of the plurality of nodes. Each of the plurality of edges indicates that the two or more plurality of nodes are communicatively coupled to each other within the network. A set of paths is identified between two or more nodes in the plurality of nodes corresponding to a set of call flow information within the at least one call detail record. A state of each network element represented by the two or more nodes in the set of paths is determined based on the call detail record.

Network load estimation and prediction for cellular networks

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Nanuet, NY, United States of America

Kang-Won Lee