Semes Co., Ltd.

Kang Sul Kim

Kyeong Min Lee

Yong Jun Kim

Tae-keun Kim

Junhee Choi

Min Hee Cho

Hee Man Ahn

Tae-Keun Kim

Tae Keun Kim

Won Young Kang

The present invention provides a substrate treating apparatus, including: a treatment container having a treatment space therein; a support unit for supporting and rotating the substrate in the treatment space; and a liquid supply unit for supplying a liquid onto the substrate, in which wherein the support unit includes: a body on which the substrate is seated; and a support shaft coupled to the body, and an upper surface of the body is provided with a central portion including a center of the body and an edge portion surrounding the central portion, and a vacuum hole is formed in the central portion, and a groove is formed in the edge portion.

Support unit and substrate treating apparatus including the same

Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.

Substrate processing apparatus and substrate processing method

Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.

A liquid supply apparatus is provided. The liquid supply apparatus includes: a base unit having an operating space, an inlet port, through which a treatment liquid is introduced, and an outlet port, through which the treatment liquid is discharged, formed therein; bellows having the operating space formed on its outside within the base unit, including an inlet and an outlet, which form ends of the inlet and outlet ports, respectively, of the base unit and communicate to create a storage space that the treatment liquid flows in and out of, and expanding or contracting to increase or reduce the volume of the storage space; an operating unit supplying operating fluid into or discharging the operating fluid from the operating space; and a drain line communicating with the storage space, from below the base unit, and discharging the treatment liquid, wherein the operating unit supplies the operating fluid into the operating space to enable the bellows to contract, or discharges the operating fluid from the operating space to enable the bellows to expand, and the drain line discharges residual treatment liquid remaining in the storage space to replace the treatment liquid.

Liquid supply apparatus and substrate treatment apparatus including the same

A substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate, and supplying a rinse liquid onto the substrate may be provided.

Growing community of inventors

Chungcheongnam-do, South Korea

Kang Sul Kim