Samsung Electronics Co., Ltd.

Kang-Soo Chu

Jae-sik Min

Young-ung Ha

Jong-Ho Yang

Sung-Gun Kang

Jae-Eun Park

A method of fabricating a semiconductor device having multiple gate dielectric layers and a semiconductor device fabricated thereby, in which the method includes forming an isolation layer defining first and second active regions in a semiconductor substrate. A passivation layer is formed on the substrate having the isolation layer. A first patterning process is carried out that etches the passivation layer on the first active region to form a first opening exposing the first active region, and a first dielectric layer is formed in the exposed first active region. A second patterning process is carried out, which etches the passivation layer on the second active region to form a second opening exposing the second active region, and a second dielectric layer is formed in the exposed second active region.

Method of fabricating semiconductor device having multiple gate dielectric layers and semiconductor device fabricated thereby

An inkjet print head and method of fabricating the same. The inkjet print head includes: a substrate having an ink-feed hole, an interlayer dielectric layer formed around the ink-feed hole on the substrate, at least one metal layer formed on the interlayer dielectric layer, and an anti-moisture part formed between the ink-feed hole and the at least one metal layer to prevent ink moisture in the ink-feed hole from contacting the at least one metal layer. The inkjet print head and the method of fabricating the same are capable of preventing problems such as de-lamination between layers, electrical short-circuit, circuit malfunction, and corrosion of a metal interconnection layer, since it is possible to prevent penetration of ink moisture from layers having absorbent characteristics into the metal interconnection layer, a logic region, or a pressure driving part. Therefore, it is possible to improve the lifespan and reliability of the inkjet print head as well as to increase productivity and reduce manufacturing cost by increasing yield.

Growing community of inventors

Yongni-si, South Korea

Kang-Soo Chu