Hynix Semiconductor Inc.

Kang-Pok Lee

Hae-Jung Lee

Kyeong-Hyo Lee

A method for fabricating a semiconductor device includes forming a plurality of plugs over a die region and an edge bead removal (EBR) region of a wafer, forming metal lines coupled to the plugs, removing the metal lines in the EBR region, forming an inter-layer dielectric layer over the wafer, and forming a plurality of contact holes that expose the metal lines by selectively etching the inter-layer dielectric layer through a dry etch process using a plasma etch device.

Growing community of inventors

Gyeonggi-do, South Korea

Kang-Pok Lee