Lumens Co., Ltd.

Kang-Min Han

Seung-Hoon Lee

Seung-Hyun Oh

Sung-Sik Jo

Suk-Min Han

Disclosed herein is a backlight unit including a flat substrate, a light emitting device mounted on the flat substrate, a light guide plate disposed on the flat substrate, and a reflector being inserted to be disposed in a through-hole and having a contacted reflection portion contacted to the light emitting device and a spaced reflection portion spaced from the light emitting device. The light guide plate may include an inner wall surface defining the through-hole which accommodates the light emitting device. The contacted reflection portion and the spaced reflection portion are configured to reflect light generated in the light emitting device to penetrate into the light guide plate through the inner wall surface.

Backlight unit, double cone-shaped reflector, double cone-shaped reflector strip, illumination apparatus, and method of manufacturing double cone-shaped reflector

Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first pad and a second pad; a lead frame having a first electrode installed at one side of an electrode separation space and a second electrode installed at the other side thereof, and having the light emitting device seated thereon; a first bonding medium installed between the first pad and the first electrode so that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other; and a second bonding medium installed between the second pad and the second electrode so that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other, wherein at least one first accommodating cup part accommodating the first bonding medium therein is formed in the first electrode of the lead frame, and at least one second accommodating cup part accommodating the second bonding medium therein is formed in the second electrode of the lead frame.

Growing community of inventors

Suwon-si, South Korea

Kang-Min Han