Korea Institute of Fusion Energy

Kang Il Lee

Yong Sup Choi

Dong Chan Seok

Seung Ryul Yoo

Yong Ho Jung

Jong Sik Kim

Hyun Young Jeong

Soo Ouk Jang

Tai Hyeop Lho

Young Woo Kim

Taihyeop Lho

A window device for diagnosis of plasma OES (Optical Emission Spectroscopy), is disclosed and includes a housing including a first chamber and a second chamber horizontally adjacent to each other; a connection opening defined in one face of the housing and between the first and second chambers, the connection opening faces toward an opening through which light of plasma from a plasma chamber is exposed to the connection opening; an observation window opening defined in an opposite face of the housing opposite to the connection opening, the observation window opening is coaxial with the connection opening, the light of the plasma transmits through the observation window opening, and is incident to a light receiver of an OES sensor; an observation window positioned inside the observation window opening and in the housing; a winder and a rewinder installed in the first and second chambers, respectively; and a transparent film.

Window for plasma OES diagnosis, and plasma apparatus using same

Disclosed is a plasma surface treatment apparatus for conductive powder. The plasma surface treatment apparatus for conductive powder comprises: a reaction chamber including a linear gas inlet at the lower end thereof and a gas outlet at the upper end thereof, and having a vertical cross section that is funnel-shaped; and a plasma jet generation device that is located below the linear gas inlet and is configured to discharge a plasma jet into the reaction chamber from below in an upward direction through the linear gas inlet, wherein powder is accommodated in the reaction chamber and is treated by plasma while buoyed by the plasma jet.

Plasma surface treatment apparatus for conductive powder

A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.

Point etching module using annular surface dielectric barrier discharge apparatus and method for control etching profile of point etching module

An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.

Atomic layer polishing method and device therefor

Growing community of inventors

Gunsan, South Korea

Kang Il Lee