Kmw Inc

Dongbu Electronics, Co. Ltd.

Dongbu Electronics

Dongbu Electroncis Co., Ltd.

Kang-Hyun Lee

Young-Chan Moon

Gil-Ho Lee

Duk-Yong Kim

In-Ho Kim

Oh-Seog Choi

Jung-Pil Lee

Hyoung-Seok Yang

Seok Sung

Taek-Dong Kim

Joon Bum Shim

Han Gyoo Hwang

A Base Station (BS) antenna in a mobile communication system is provided, in which a reflective plate has a frontal surface onto which radiation elements are attached, and at least one protector is attached onto the reflective plate, surrounding at least part of the reflective plate.

Base station antenna in a mobile communication system

Disclosed is a radio frequency (RF) switch including: a circulator having first to third nodes, which are connected to first to third ports, respectively; and a slot line pattern unit installed in a connection line between the third node of the circulator and the third port so as to carry out signal transmission or interception, wherein the slot line pattern unit includes a switching circuit, which is installed at a predetermined location so as to transmit or intercept a signal by maintaining or short-circuiting a gap of a slot line corresponding to the installed location according to an external switching control signal.

Radio frequency switch

Disclosed is a DPDT RF switch. The DPDT RF switch includes: first to fourth transmission lines for forming first to fourth ports, respectively; and first to fourth slot line pattern sections. The first slot line pattern section includes: a first slot line; and a first switching device for blocking signal transfer by short-circuiting a gap of a slot line. The third slot line pattern section includes: a third slot line; and a third switching device for blocking signal transfer by short-circuiting a gap of a slot line. The second slot line pattern section includes: a first loop-shaped slot line; a second slot line; and a second switching device for blocking signal transfer by short-circuiting a gap of a slot line. The fourth slot line pattern section includes: a second loop-shaped slot line; a fourth slot line; and a fourth switching device for blocking signal transfer by short-circuiting a gap of a slot line.

DPDT RF switch and TMA using the same

An RF switch includes first, second and third transmission lines for forming ports, respectively, and first, second and third slot line pattern portions connected to one another, for transferring signals to the first, second and third transmission lines, respectively. The first slot line pattern portion has a slot line pattern for transferring a signal received from the first transmission line to a connection point with the other slot line pattern portions, and a switching circuit for shorting the gap of a corresponding slot line and thus blocking the signal transfer. The second slot line pattern portion includes a loop slot line formed by a first and a second half loop slot line, a second sub-slot line for transferring a signal received from the connection point to the second transmission line through the loop slot line, and a switching circuit for shorting the gap of a corresponding slot line.

The present invention is directed to a method for fabricating a metal line of a semiconductor device. The method comprises the steps of forming an insulation layer, a metal layer and an organic anti-reflection coating in order on a semiconductor substrate on which devices or lower lines are formed, forming a photoresist pattern having an opening of certain width on the organic anti-reflection coating, forming a buffer layer of certain thickness on the photoresist pattern, and selectively removing the metal layer at a lower side of the opening by performing a dry etching process.

Method for fabricating metal line of semiconductor device

An RF switch is provided. In the RF switch, a T-junction slot line has a horizontal slot line and a vertical slot line. An open-end circuit is provided at each end portion of the horizontal and vertical slot lines. A first transmission line delivers signals from and to one portion of the horizontal slot line, and a second transmission line delivers signals from and to the other portion of the horizontal slot line. A third transmission line delivers signals from and to the vertical slot line. A switching circuit selectively switches the signal path of the one or the other portion of the horizontal slot line to the vertical slot line according to an external switching control signal.

A method for forming a contact hole for a dual damascene interconnection in a semiconductor device. A via hole is formed to expose an etch stop film on a lower metal film through an intermetal insulating film. The via hole is filled with a sacrificial film. A bottom antireflective coating film and a mask pattern are formed on the intermetal insulating film and the sacrificial film. An etching process is performed to form a trench to expose a portion of a surface of the intermetal insulating film and a top surface of the sacrificial film. A post etch treatment is performed to remove the sacrificial film, using the mask pattern as an etching mask. The exposed etch stop film is removed to expose a portion of a surface of the lower metal film. A passivation process is performed for the exposed surface of the lower metal film.

Method for forming contact hole for dual damascene interconnection in semiconductor device

A method of forming a pattern finer than an existing pattern in a semiconductor device using an existing light source and a hard mask, and a method of removing the hard mask which is used as an etching mask. The method includes forming an oxide layer on a substrate; forming a polysilicon layer on the oxide layer; forming a hard mask on the polysilicon layer; depositing photoresist on the hard mask and patterning the hard mask by using the photoresist; and etching the polysilicon layer using the pattern embodied by the hard mask. By fabricating a gate oxide with a finer linewidth using a hard mask and existing equipment, the present invention can control the linewidth required in each product by using an etching process, and, therefore, has advantages such as expandability of process, extension of generality, and maximization of productivity in the production line.

Submicron semiconductor device and a fabricating method thereof

A method for forming a dual damascene interconnection in a semiconductor device. An etch stop film and an intermetal insulating film are formed sequentially on a lower metal film. A via hole is formed to expose a portion of a surface of the etch stop film through the intermetal insulating film. A sacrificial film is formed to fill the via hole. Portions of the intermetal insulating film and the sacrificial film are removed to form a trench. The sacrificial film is removed to expose the portion of the surface of the etch stop film. A plasma etching process is performed at a predetermined temperature using an etching gas to remove the exposed portion of the etch stop film and to prevent or suppress generation of a polymer. A diffusion barrier film is formed within the trench and the via hole such that the diffusion barrier contacts the lower metal film. An upper metal film is formed on the diffusion barrier.

Growing community of inventors

Gyeonggi-do, South Korea

Kang-Hyun Lee