Au Optronics Corporation

Kang-Hung Liu

Tsung-Tien Wu

Tsung-Yi Lin

Pin-Miao Liu

Cheng-Chieh Chang

Ho-Cheng Lee

Chih-Che Kuo

Chien-Cheng Chang

A pixel structure includes a plurality of sub-pixels. Each of the sub-pixels includes a first light-emitting diode (LED) and a second LED. The first LED is configured to emit a first color light. The second LED is configured to emit a second color light. Each of the first LED and the second LED includes an anode and a cathode. The anode of the first LED and the anode of the second LED are coupled to a same signal line. The cathode of the first LED and the cathode of the second LED are coupled to different signal lines.

Pixel circuit structure and method for driving the same

A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.

Method of transferring micro-device

A method for transferring micro devices is provided. The method includes the following operations: providing a carrier substrate and forming micro devices on the carrier substrate; forming a fixing layer on the carrier substrate, in which the fixing layer is at least in contact with bottom parts of the micro devices; patterning the fixing layer to selectively expose a portion of the micro devices; providing a transfer device correspondingly located on the carrier substrate, and picking up the exposed micro devices by the transfer device; and providing a receiving substrate and transferring the exposed micro devices to the receiving substrate.

Method for transferring micro devices and method for manufacturing display panel

A display panel pixel unit and display panel using the same is provided. The display panel pixel unit includes a first electrode layer, a light-emitting element, and a light-filtering layer. The light-emitting element is disposed on the first electrode layer. The light-emitting element has a light-emitting surface on the side opposite to the first electrode layer. The light-filtering layer is above the first electrode layer and forms a space with the first electrode layer to contain at least a portion of the light-emitting element. The light-filtering layer has a light-filtering area corresponding to the area of the first electrode layer that is exposed by the light-emitting element and light-transmissible area corresponding to the light-emitting surface.

Growing community of inventors

Hsin-Chu, Taiwan

Kang-Hung Liu