Other

Hyundai Calibration and Certification Technologies Co. Ltd.

Applied Materials, Inc.

Kang-Ho Ahn

Sang-Soo Kim

Harry Q Lee

Patrick D Kinney

Yuri S Uritsky

Hae-Young Jeong

The present invention discloses an apparatus and method for manufacturing ultra-fine particles using corona discharge capable of manufacturing the ultra-fine particles nanometers in size from a reaction gas using the corona discharge. In the apparatus for manufacturing ultra-fine particles of the present invention, a reaction gas feeder supplies a nozzle with reaction gas, and the reaction gas is injected. When a power supply applies a high voltage to the nozzle, the corona discharge occurs at the nozzle. Thus, the injected reaction gas is dissolved, and a large number of ultra-fine particles are produced. Then, a collection plate collects the ultra-fine particles. In addition, a duct encloses the nozzle, so that a passage is formed between the nozzle and duct. Sheath gas supplied to the passage of the duct forms a gas curtain between the nozzle and the collection plate, so that the gas curtain leads the flow of the ultra-fine particles. If other reaction gas is supplied to the passage of the duct and heat energy is supplied thereto, the other reaction gas reacts thermochemically, so that a large number of other ultra-fine particles are produced. The ultra-fine particles produced by the corona discharge are coated with the other ultra-fine particles. If the corona discharge is generated while the ultra-fine particles and the other reaction gas are injected by another nozzle positioned downstream of the nozzle, the ultrafine particles are coated with the other ultra-fine particles produced from the other reaction gas.

Apparatus for manufacturing ultra-fine particles using corona discharge and method thereof

The present invention discloses apparatus and method for rapidly and easily measuring the numbers and size distribution of low concentration particles which exist in a clean space such as a clean room. The apparatus and method according to the present invention measures the numbers of particles by charging particles to a monopolarity, collecting the particles by applying a voltage to an electrode and attaching the charged particles of a certain size or less thereto, separating the charged particles of the certain size or more according to size by the particle separating ducts. The apparatus for measuring the number of particles according to the present invention makes it possible to obtain a size distribution of particles in the air by a single measurement and to rapidly and easily measure it even though the number of the particles in the air is small.

Apparatus for measuring numbers of particles and method thereof

Provided is apparatus for controlling flow rate of gases used in semiconductor device by differential pressure by generating differential pressure in a fluid path. A differential pressure generation element generates pressure difference in the fluid path of gases used in semiconductor device fabrication, a pressure, sensor which is installed at a bypass of the fluid path detects the pressure difference, and a central processing unit (CPU) measures and controls a flow rate of the gases, thereby the present invention is capable of controlling the flow rate precisely and rapidly, and enhancing the degree of purity of the gases by the filtering function of the differential pressure generation element itself.

Apparatus for controlling flow rate of gases used in semiconductor device by differential pressure

A condensation particle counter measures the number of ultra-fine particles by growing the ultra-fine particles through a condensing process. The counter includes a capillary in which vapor of operating liquid is condensed and the ultra-fine particles grow. An insulating material surrounds the capillary to shut out heat flow between the capillary and the environment. The condensation particle counter can use various operating liquids including alcohol and water, and can be also applied to semiconductor clean rooms.

Condensation particle counter

A method for reducing targeting errors encountered when trying to locate contaminant particles in a high-magnification imaging device, based on estimates of the particle positions obtained from a scanning device. The method of the invention uses three techniques separately and in combination. The first technique includes selecting at least three reference particles, to provide multiple unique pairs of reference particles for computation of an averaged set of coordinate transformation parameters, used to transform particle position coordinates from the coordinate system of the scanning device to the coordinate system of the imaging device. The averaged transformation parameters result in much smaller targeting errors between the estimated and actual positions of the particles. The targeting errors are further reduced by the use of multiple scans of the scanning device. In a third technique, accumulated reference particle targeting errors observed in prior processing of other wafers are used to reduce these targeting errors when processing a new wafer.

Growing community of inventors

Seoul, South Korea

Kang-Ho Ahn