Stemco Co., Ltd.

Kang Dong Kim

Sung Jin Lee

Chang Hoon Han

Gun Woo Shin

Chul Ho Yoon

Hyun Woo Kim

Jung Sub Kim

Won Tae Jo

Hong Man Kim

Duck Jae Seo

Ho Byung Kim

Provided is a coil apparatus having a plurality of coil patterns formed on one surface. The coil apparatus comprises at least one coil substrate, wherein the coil substrate comprises a base layer, and a coil pattern formed on the base layer and including a pattern portion, a via portion part or an external electrode portion, and a coil substrate, wherein the coil substrate is wound in a multi-helical structure in response to a plurality of coil patterns being provided.

Coil apparatus

A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

Circuit board and method for manufacturing same, and electronic device comprising same circuit board

The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.

Flexible circuit board and method for producing same

Growing community of inventors

Seoul, South Korea

Kang Dong Kim