Cheil Industries Inc.

Kang Bae Yoon

Kyoung Soo Park

Kyoung Hun Shin

Hyun Hee Namkung

Hyun Joo Seo

Cheon Seok Lee

Sang Sik Bae

Bong Yong Kim

Byeong Hwan Jeon

Young Ju Shin

Do Hyun Park

Kyong Hun Shin

Young Jin Kwon

A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa&#xb7;s at 80&#xb0; C.

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device

An electrical connection material between conductors includes about 40 wt % to about 80 wt % of a urethane-modified acrylate resin, based on a total weight of the electrical connection material, the electrical connection material exhibiting, after curing, a tensile elongation of about 100% to about 500% and a yield point strain of about 10% to about 50% in a stress-strain curve.

Electrical connection material and a solar cell including the same

A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.

Composition for circuit connection film and circuit connection film using the same

An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.

Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods

An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

Adhesive composition and anisotropic conductive film using the same

An anisotropic conductive film (ACF) composition includes a thermoplastic resin having a weight average molecular weight of about 150,000 to about 600,000, a thermosetting curing agent having a weight average molecular weight of about 100 to about 10,000, the thermosetting curing agent including an acrylate functional group or a methacrylate functional group, an organic peroxide, a silane coupling agent, and conductive particles.

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Uiwang-si, South Korea

Kang Bae Yoon