Hitachi Maxell, Limited

Other

Maxell Seiki, Ltd.

Kaname Tamada

Hiroyoshi Takagi

Koichi Ozaki

Masayoshi Onishi

Seiji Kegai

Toshinobu Sueyoshi

Ryuzo Fukao

Kazuhiko Daido

Kyouichi Kohama

Yusuke Hirai

There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip and a coil are embedded in a flexible substrate comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force . {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric is superposed on the IC chip and coil. {circle around (4)} A top force is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.

Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module

A board for an IC card includes a main body in the shape of a plate. A recess is formed in the main body for receiving and adhering a component therein. The recess includes a bottom wall integrated as one body with the main body, and an adhesion section for adhering the component. A wall of the adhesion section is an uneven surface. Ribs may be provided which extend from an inner side of the recess to contact the component.

Board for IC card having component mounting recess

A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.

Injection molding method for board for IC card

Growing community of inventors

Ibaraki-Ken, Japan

Kaname Tamada