Toyoda Gosei Co., Ltd.

Koha Co., Ltd.

Other

Kanae Matsumura

Hideaki Kato

Shunsuke Ohtsuka

Yuji Takahashi

Akira Mabuchi

Koichi Kaga

Kiyotaka Teshima

Hisaki Kato

Takemasa Yasukawa

Hideyuki Imai

Masato Ueno

Hiroshi Yokoi

Kazuhiro Sakai

Satomi Watanabe

Kazutoshi Miyake

Kazuya Ito

Kyouichi Fujinami

Naoki Yoshimura

Masato Kawamura

Hiroko Shibakawa

Yasutsugu Sugiura

Kazuki Yabashi

Takayoshi Iwata

The vehicle interior component includes a front surface side space and a slit. A light emitting part, which is disposed on a vehicle interior outer side with respect to at least one of the vehicle interior outer side end of the panel lower portion of the upper panel and the vehicle interior outer side end of the panel upper portion of the lower panel and emits light emitted obliquely upward toward an inside of a vehicle interior through the slit, is provided.

Vehicle interior-dedicated light emitting device

An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

LED lamp

A notch portionA is disposed on a formation surface of a wiring patternand is located in a contact point with a wiring patternof an outside substrate, so that a soldermelted by reflow soldering slowly flows up along an edge of the notch portionA, improving a solder-joint performance. The notch portionA is formed in a recess shape as formed by cutting away the substrateand as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portionA.

Light-emitting diode lamp having a terminal portion with a notch portion

After measurement, light-emitting elements are temporarily numbered (), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.

Method and apparatus for arranging light-emitting diodes and light-emitting elements

In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the electrically conductive leads.

LED device and manufacturing method thereof

In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light emitting element. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the electrically conductive leads.

A light source in a backlight portion is composed of red LEDs, green LEDs, and blue LEDs. The numbers of respective kinds of LEDs used are selected so that the number of blue LEDs is not smaller than the number of red LEDs and the number of blue LEDs is not smaller than the number of green LEDs.

Liquid-crystal display device

A sealing member for a short-wavelength light emitting element comprises a main agent and a curing agent. The main agent comprises a first component of an alicyclic epoxy produced by hydrogenating an aromatic epoxy, preferably a bisphenol A epoxy, and a second component of an alicyclic epoxy having a lower molecular weight than the first component. The mixing amount of the second component is not less than 10% by weight and less than 30% by weight based on the main agent.

Light emitting apparatus

An alicyclic epoxy resin is used as a material for forming a member for sealing a Group III nitride compound semiconductor light-emitting device.

Light-emitting system with alicyclic epoxy sealing member

The present invention is directed to a vibration insulating assembly including a rubber vibration insulator and metallic members bonded thereto. In particular, the present invention relates to a method for manufacturing the same, by which the quality of the resulting assembly is improved by providing a high bonding strength between the vibration insulator and metallic members. Retainers are provided about the peripheries of the bonding surfaces of the rubber vibration insulator in order to restrict displacement and deformation of the rubber vibration insulator across the bonding surfaces or at the bonding interface with the metallic members and to facilitate its positioning. The presence of the retainers allows for the application of a predetermined pressure on the bonding surfaces to enhance the bonding strength while preventing an undesirable strain from forming in the bonding surface of the rubber vibration insulator. At least one and preferably a plurality of grains or recessed portions are preferably formed in the bonding surfaces of the rubber vibration insulator to be bonded to the metallic members. An adhesive, which is preferably solvent-free, is applied to these bonding surfaces to effect bonding.

Growing community of inventors

Aichi-ken, Japan

Kanae Matsumura