Kyocera Corporation

Kanae Horiuchi

Yousuke Moriyama

Akihiko Funahashi

Kenichi Kohama

Masatsugu Iiyama

An electronic element mounting substrate includes a substrate including a first layer, a second layer located on a lower surface of the first layer, and a third layer located on a lower surface of the second layer, and on which an electronic element is to be mounted. The substrate has a via conductor that passes through the first layer to the third layer in a vertical direction. The substrate includes respective electrical conductor layers located between the respective layers and connected to the via conductor in a plan perspective. Each electrical conductor layer includes a land portion surrounding the via conductor, a clearance portion surrounding the land portion, and a peripheral portion surrounding the clearance portion and electrically insulated from the land portion with the clearance portion interposed between the land portion and the peripheral portion. The first land portion has, in a plan perspective, a first portion overlapping the second land portion, and the first clearance portion has, in a plan perspective, a second portion not overlapping the second clearance portion. The first peripheral portion and the second peripheral portion each have, in a vertical cross-sectional view, an end portion that becomes thinner as a distance from the via conductor increases.

Electronic element mounting substrate, electronic device, and electronic module

An electronic device mounting board includes an inorganic substrate, a frame, and a bond. The inorganic substrate includes, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area. The frame is located in the surrounding area of the inorganic substrate to surround the mount area. The bond is located in the surrounding area between the inorganic substrate and the frame. The bond has a plurality of cavities.

Electronic device mounting board and electronic package

An imaging element mounting substrate may include an insulating substrate and a metal substrate. The insulating substrate may include a first mounting region for mounting an imaging element on a top surface, and a second mounting region located a distance away from the first mounting region for mounting one or more electronic components. The insulating substrate may include a fixed region for securing a lens housing surrounding the first mounting region. A metal substrate may be bonded to a bottom surface of the insulating substrate. A third mounting region located between the first mounting region and the second mounting region in the fixed region of the insulating substrate may be positioned with respect to the center of the insulating substrate in a plan view. The metal substrate may be located to overlap with the third mounting region and bestride the first mounting region and the second mounting region.

Imaging element mounting substrate, imaging device and imaging module

There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.

Electronic device mounting board and electronic apparatus

There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; and a first conductor disposed on a side surface of the frame section, the first conductor being electrically connected to the electrode pad, the electrode pad extending over a side surface of the first conductor from the upper surface of the frame section. By suppressing separation of the first conductor from the insulating base by means of the electrode pad, disconnection at the first conductor can be suppressed.

Electronic device mounting substrate, electronic apparatus, and imaging module

There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base.

Growing community of inventors

Kyoto, Japan

Kanae Horiuchi