Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Kan Wang

Hsianglun Hsu

Cunjun Xia

Haoran Wang

Junyuan Wang

Yijia Wang

The present application provides a display panel and a display device, the display panel includes a light-emitting layer and a light-concentrating layer positioned on the light-emitting layer, the light-emitting layer includes a plurality of light-emitting units, the light-concentrating layer includes a first member and a second member for converging light, wherein the first member includes a plurality of openings, an edge of the openings includes a first inclined surface for reflecting light and a second inclined surface positioned on the first inclined surface, and the first inclined surface and the second inclined surface are connected by a first connecting portion.

Display panel and display device

The present application provides a display panel and a display device. The display panel includes an array substrate, a pixel definition layer, an organic light-emitting layer, a cathode layer, an encapsulation layer, and an absorption layer. The absorption layer is arranged on one side of the pixel definition layer away from the array substrate. The absorption layer is arranged corresponding to at least a portion of the pixel definition layer in a curved display region for selectively absorbing at least one color light, so as to reduce a risk of color shift in a white screen at large viewing angles without causing color shift of images at a vertical viewing angle.

An organic light emitting diode display device includes a substrate, a light emitting region disposed on the substrate, a packaging layer covering the light emitting region, and a protective component. The substrate includes a folded region in a first direction and a non-folded region in a second direction, and the first direction is perpendicular to the second direction. The protective component is disposed in the folded region in the first direction and the unfolded region in the second direction. The protective component reduces cracking at a packaging layer and improves bending durability of the organic light emitting diode display device.

Organic light emitting diode display device

A display structure is provided. The display structure includes a substrate, a dam, a first film layer, a second film layer, and a third film layer. The third film layer has a first spread rate for the first film layer, the third film layer has a second spread rate for the second film layer, and the first spread rate is less than the second spread rate. The spread rates of the third film layer on the first and second film layers are different, so as to slow the spread rate of the third film layer near an area of the dam, thereby reducing the risk that the third film layer overflows the dam, so that the encapsulation reliability of the display structure can be improved.

Display structure having a dam and gap

The present disclosure provides a flexible organic light-emitting diode (OLED) device and a fabrication method thereof, wherein the flexible organic light emitting diode (OLED) device includes a substrate, an array unit layer, a light-emitting device layer, and an encapsulation layer that are sequentially disposed. The encapsulation layer includes a first inorganic layer, a first organic layer and a second inorganic layer that are sequentially disposed. The second inorganic layer has a continuous wavy curved-configuration, and an interface between the second inorganic layer and the first organic layer has a continuous wavy curved-shape. The present disclosure is directed to a flexible OLED device using a novel outer inorganic layer to increase the contact area between the outer inorganic layer and the inner organic layer, thereby effectively reducing risks of breakage of the outer inorganic layer.

Flexible organic light-emitting diode (OLED) device of reduced stess at bending place and fabrication method thereof

An array substrate, a fabricating method thereof, and a display device are provided. A portion of the array substrate aligned to a secondary function region has a first conductive layer and a second conductive layer disposed on two opposite surfaces of the substrate. A circuit in the second conductive layer is electrically connected to a circuit of a main display region, and a circuit of a driving circuit board is electrically connected to a circuit of the first conductive layer. In this way, a cell on film (COF) is directly placed on a back surface of the substrate, and the main display region and the COF are connected by a passing layer passing through the substrate. No further bending is required.

Array substrate, fabricating method thereof, and display device

A display panel and a manufacturing method thereof are provided. The display panel has a display area, a non-display area, and a bendable connection area being located between the display area and the non-display area and connecting the display area with the non-display area. The display panel includes a substrate; an inorganic insulating layer disposed on the substrate, wherein in the bendable connection area, a plurality of recesses are defined in the inorganic insulating layer; an organic filling layer filled in the plurality of recesses in the inorganic insulating layer and having a concave curved surface; and a wiring layer disposed on the inorganic insulating layer, wherein a concave curved surface formed on the wiring layer corresponds to the concave curved surface of the organic filling layer in each of the recesses.

Display panel and method for manufacturing same

An organic light emitting diode (OLED) display panel and a encapsulation method of the organic light emitting diode display panel are provided. The encapsulation method includes steps of providing an OLED display panel having an OLED light emitting element layer in a display area thereof and an organic peeling layer in a non-display area thereof; laminating an inorganic film layer prepared in a full-surface coating method and an organic film layer only covering the display area sequentially; and peeling off the organic peeling layer together with the inorganic film layer on the surface of the organic peeling layer, so as to form a thin film encapsulation layer.

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Hubei, China

Kan Wang