Lintec Corporation

Kan Nakata

Kenji Kobayashi

Hideaki Nonaka

Yoshiaki Sugishita

A cutting device that, after a sheet is stuck on a wafer on a sticking table, cuts the sheet along the outer edge of the wafer. The cutting device includes a robot body disposed besides the sticking table and a cutter blade supported by a tool holding chuck positioned at the front end of the robot body. The cutter blade is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet in a state that the posture thereof is adjusted along a preset movement track.

Sheet cutting device and cutting method

A sheet sticking apparatuscomprises a sheet feed-out unitfor feeding out an adhesive sheet S to a position facing a surface of a semiconductor wafer W, and a press rollerfor imparting a press force to the adhesive sheet S to stick the adhesive sheet S to the wafer W. The sheet feed-out unitincludes a tension measuring meansfor measuring the tension of the adhesive sheet S between a feed-out headand the press roller. The tension measuring meansmaintains the tension to a constant level to prevent catching of air bubbles between the adhesive sheet S and the wafer W as well as to prevent warp deformation of the wafer stuck with the sheet.

Growing community of inventors

Tokyo, Japan

Kan Nakata