Denso Corporation

Kan Kinouchi

Mitsuhiro Saitou

Yutaka Fukuda

Norihisa Imaizumi

Sadahiro Akama

Toshihiro Nagaya

Koji Numazaki

Takashi Nagasaka

Yukihiro Kato

Koji Takeuchi

Hiroshi Nomura

Atsushi Kanamori

Yukihiro Maeda

Hirokazu Imai

Yuji Ootani

Hiroyuki Yamakawa

Michitake Kuroda

Yoshiharu Harada

Mitsuhiro Saito

Akihiro Fukatsu

An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

Semiconductor device

Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

Semiconductor device including bonded wire based to electronic part and method for manufacturing the same

A semiconductor device has a case, a printed circuit board, a fin, and a ceramic substrate mounting a semiconductor element thereon. The case contains the printed circuit board, the ceramic substrate and the fin. The fin and the case radiate heat transmitted from the ceramic substrate. The fin has protrusions on a contact face facing a contact face of the case. The fin contacts the case though the protrusions when the fin is fixed to the case. The protrusions serve as heat radiating path.

Semiconductor device having heat radiating member

In order to form a hollow portion in a resin block after a molding operation, a projection for forming a hollow portion in a resin block is formed on an upper die. A front face of the projection is processed into a mirror finished face (smoothed flat face). Recess portions are formed in the front face of the projection. The position of the recess portions correspond to wire bonding regions of a lead frame. The lead frame is clamped between an upper die and a lower die. A molding resin is injected into a space between the upper and lower dies. As a result, an excellent wire bonding face can be secured at regions on the lead frame in correspondence with the recess portions.

Resin sealing type semiconductor device

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Okazaki, Japan

Kan Kinouchi