Kaneka Corporation

Kanera Corporation

Kan Fujihara

Kazuhiro Ono

Kiyokazu Akahori

Takaaki Matsuwaki

Yoshihide Sekito

Tetsuya Kogiso

Atsushi Kumasaki

A polyimide resin of the present invention contains a repeating unit represented by the formula (1). Xis a tetravalent organic group having at least one ring structure, and each two of four carbonyl groups bonded to Xform a pair and, together with Xand a nitrogen atom, form a five-membered ring. Ris a hydrogen, an alkyl group having 1-9 carbon atoms, or an alkoxy group having 1-10 carbon atoms. Y is a divalent organic group having a phenolic hydroxyl group. The polyimide resin of the present invention can be practically used as a thermosetting resin composition or a positive type photosensitive resin composition. 

Polyimide resin and resin composition

A polyimide fiber assembly of the present invention includes polyimide fibers having curved shapes with an average fiber diameter falling within a range of greater than 1 &#x3bc;m to not greater than 100 &#x3bc;m, the polyimide fiber assembly having a bulk density falling within a range of not less than 1 kg/mto not greater than 30 kg/m. This makes it possible to realize a polyimide fiber assembly that is both excellent in thermal insulation performance and sound absorbency and light in weight. The polyimide fiber assembly of the present invention can be obtained by a production method comprising the steps of: (i) discharging a polymeric resin solution obtained by dissolving polyamic acid or polyimide in an organic solvent; and (ii) using external force to cause the polymeric resin solution thus discharged to fly in a direction of the external force, the external force being external force of gas from a direction intersecting with a discharge direction in which the polymeric resin solution is discharged, and then forming a polymeric resin into fibers by spinning while vaporizing the organic solvent contained in the polymeric resin solution.

Method of making polyimide fiber assembly

An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250&#xb0; C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.

Polyimide precursor composition, use thereof and production method thereof

The present invention relates to an adhesive film with which a flexible metal-clad laminate is obtained with suppressed dimensional changes occurred when produced by a laminating method; and a flexible metal-clad laminate comprising the adhesive film and a metal foil bonded thereto. The adhesive film comprises a polyimide film and, formed on at least one side thereof, an adhesive layer comprising a thermoplastic polyimide and has coefficients of linear expansion satisfying the relationship 1.0&#x3e;(coefficient of linear expansion in the MD direction)/(coefficient of linear expansion in the TD direction)&#x3e;0.1. This adhesive film may be one produced continuously and further satisfying the relationship 1.70&#x3e;(elastic modulus in the MD direction)/(elastic modulus in the TD direction)&#x3e;1.05 when the adhesive film has an MD modulus of 5 GPa or higher throughout the whole width thereof. That adhesive film may be one produced continuously and further satisfying the relationship 2.00&#x3e;(elastic modulus in the MD direction)/(elastic modulus in the TD direction)&#x3e;1.10 when the adhesive film has an MD modulus less than 5 GPa throughout the whole thereof.

Adhesive film, flexible metal-clad laminate, and processes for producing these

A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100&#xb0; C. to 200&#xb0; C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.

Polyimide film and use thereof

A polyimide film of the present invention is a polyimide film having a dynamic viscoelasticity whose tan &#x3b4; peak is located in a range of not less than 310&#xb0; C. but not more than 410&#xb0; C., and whose tan &#x3b4; value at 300&#xb0; C. is not more than 0.05, or a polyimide film prepared by copolymerizing (a) an acid dianhydride component including a biphenyltetracarboxylic dianhydride and a pyromellitic dianhydride, and (b) a diamine component, and the polyimide film having such an etching speed that one side thereof is etched with a 1N potassium hydroxide solution at an etching speed of 0.1 &#x3bc;m/minute (one side) or higher. The polyimide film of the present invention possesses film properties that are necessary for use in an electronic raw material for flexible printed circuit boards and the like, and is suitable as an electronic raw material.

Polyimide film and laminate having metal layer and same

A polyimide film according to the present invention satisfies Condition (1) in which a tear propagation resistance variation Cis not more than 1.0 g, and/or Condition (2) in which a swelling coefficient Cafter being dipped in an alkaline solution is not more than 20.0. By satisfying these conditions, workability of the polyimide film can be improved and working defects can be effectively prevented, thereby improving productivity of each step.

Polyimide film excellent in alkali etching processability and punchability

In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.

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Otsu, Japan

Kan Fujihara