Onwafer Technologies, Inc.

Kameshwar Polla

Costas J Spanos

Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measure data so as to provide corrected parameter data having increased accuracy. One embodiment uses warpage geometry to derive the correction factors.

Sensor geometry correction methods and apparatus

Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measured data so as to provide corrected parameter data having increased accuracy.

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Berkeley, CA, United States of America

Kameshwar Polla