Freescale Semiconductor,inc.

Nxp Usa, Inc.

Conti Temic Microelectronic Gmbh

Kamel Abouda

Laurent Guillot

Pierre Turpin

Patrice Besse

John Avis Shepherd

Bertrand Vrignon

Murielle Delage

Uli Joos

Josef Schnell

Alain Salles

Thierry Laplagne

Estelle Huynh

Norbert Stuhler

Philippe Rosado

Stephanie Creveau-Boury

Helmut Henssler

Erwan Hemon

Philippe Givelin

Valerie Bernon-Enjalbert

Mohammed Mansri

Ahmed Hamada

A charging circuit for a bootstrap capacitor comprises a P MOSFET having a body diode and an N channel power MOSFET also having a body diode. The drain of the P MOSFET is coupled to the source of the N channel power MOSFET, and the source of the P MOSFET receives current from a vehicle's battery. The gate of the P MOSFET receives a control signal for turning the P MOSFET either on or off and the drain of the N channel power MOSFET is connected to a bootstrap capacitor The P MOSFET's body diode prevents current flow from the battery to the bootstrap capacitor when the P MOSFET is turned off and the N MOSFET's body diode prevents current flow from the bootstrap capacitor to the battery when the N MOSFET is turned off. The use of a power MOSFET device with its low ON resistance ensures that the capacitor is charged to a sufficiently high voltage even under low battery conditions.

Charging circuit, an inductive load control circuit, an internal combustion engine, a vehicle and a method of charging a bootstrap storage element

An integrated circuit die includes a stack of a substrate and multiple layers extending in parallel to the substrate. A number of integrated electronic components is formed in the stack, and connected to form an electronic circuit. The electronic circuit comprises a first electric contact, a second electric contact, and a coupling which couples the electric strips electrically to each other. The coupling includes a circuit via which extends through at least two of the layers. The die further includes an integrated current sensor having a coil arrangement for sensing a current flowing through a part of the electronic circuit. The coil arrangement is magnetically coupled to the circuit via over at least a part of a length of the circuit via to sensing a magnetic flux through the circuit via. A measurement unit can measure a parameter of the coil arrangement representative of a current flowing through the circuit via.

Integrated circuit with integrated current sensor

A current sensor comprises a current carrying trace located within a substrate; and a sensing trace located within the substrate proximate to the current carrying trace; wherein the sensing trace detects an electromagnetic force (emf) generated by magnetic flux inductively coupled from the current carrying trace for transmitting to a current sensing device.

High bandwidth current sensor and method therefor

A high side driver component for generating a drive signal at an output thereof for driving a high side switching device within a high voltage driver circuit. The high side driver component is arranged to operate in at least one reduced slew rate mode in which at least one drive stages is arranged to be in a non-drive state, and the high side driver component further comprises at least one discharge protection component arranged to, when the high side driver component is operating in the at least one reduced slew rate mode, receive an indication of the high voltage driver circuit being in an idle state, and cause the second switching device within the at least one drive stage in a non-drive state to be turned on, in response to the indication of the high voltage driver circuit being in an idle state.

High side driver component and method therefor

A method of and apparatus for fault detection utilizing a diagnostic procedure by a diagnostic device to detect a short circuit between at least two of a plurality of load electrical connections, the diagnostic procedure comprising applying a test electrical signal to each of the load electrical connections in turn and while applying the test electrical signal to a first one of the load electrical connections, detecting whether an electrical output is present, in response, on any other of the load electrical connections, wherein the detecting by the diagnostic device includes applying the test electrical signal to the first one of the load electrical connections in an operational mode of the apparatus when an electrically controlled switch connected to the first one of the load electrical connections is in an off state.

Apparatus and a method for detecting faults in the delivery of electrical power to electrical loads

There is described a method of optimizing the design of an electronic device with respect to electromagnetic emissions based on frequency spreading. With the method, a designer can, for example, perform a transient simulation on the device only once, and then add frequency spreading with specific parameters by simulation. The resulting frequency spread signal can be observed. The designer can thus evaluate the reduction in electromagnetic emission level, and repeat this process by iteratively applying frequency spreading each time with specific parameters but without having to modify the schematic of the device and to perform another simulation of the device. The method according to this innovation is extremely rapid as the simulation of the design does not need to be repeated at each run of the frequency spreading simulation.

Method of optimizing the design of an electronic device with respect to electromagnetic emissions based on frequency spreading introduced by software, computer program product for carrying out the method and associated article of manufacture

There is described a method of optimizing the design of an electronic device with respect to electromagnetic emissions based on frequency spreading. With the method, a designer can, for example, perform a transient simulation on the device only once, and then process the obtained signal data to add frequency spreading with specific parameters by post-processing. The resulting data can be filtered by various methods and the resulting spectrum observed. The designer can thus evaluate the reduction in electromagnetic emission level, and repeat this process by iteratively applying frequency spreading each time with specific parameters but without having to modify the schematic of the device and to perform another simulation of the device. The post-processing according to this innovation is extremely rapid as it is not a simulation process such as SPICE&#x2122;, ADS&#x2122;, etc. Only data is manipulated.

Method of optimizing the design of an electronic device with respect to electromagnetic emissions based on frequency spreading introduced by data post-processing, computer program product for carrying out the method and associated article of manufacture

There is described a method of optimizing the design of an electronic device with respect to electromagnetic emissions based on frequency spreading. With the method, a designer can add frequency spreading with specific parameters by hardware. The resulting frequency spread signal can be observed. The designer can thus evaluate the reduction in electromagnetic emission level, and repeat this process by iteratively applying frequency spreading each time with specific parameters but without having to modify the design of the device and to generate another prototype of the device.

Method of optimizing the design of an electronic device with respect to electromagnetic emissions based on frequency spreading introduced by hardware, computer program product for carrying out the method and associated article of manufacture

A packaged semiconductor device comprising a package and a semiconductor device is described. The semiconductor device comprises a first and a second GND-pad bonded to one or more GND-pins with a first and a second bond wire respectively, a first functional pad bonded to a first functional pin with a third bond wire, a semiconductor layer of a P-type conductivity, a first semiconductor component and a second semiconductor component. The first semiconductor component is arranged to, when a transient current is applied to the first functional pin, divert at least part of the transient current to the first GND-pad from the first P-region to the first GND-pad via at least a first PN-junction. The second semiconductor component comprises a second N-type region of a terminal of the second semiconductor component associated with the first functional pad. The first GND-pad is in contact with a second P-type region. The second GND-pad is in contact with a third N-type region. At least part of the second P-type region is arranged in between the first semiconductor component and the second semiconductor component, and at least part of the third N-type region is arranged in between the at least part of the first P-type region and the second semiconductor component.

Packaged semiconductor device, a semiconductor device and a method of manufacturing a packaged semiconductor device

A driver circuit is provided that receives an ON or OFF logic control signal and further has: an output arranged to be connected to a load; a power switch, having a control terminal with a first current terminal connected to a first power supply and a second current terminal arranged to be connected to the output to drive the load; a control circuit of a first type arranged between the control terminal of the power switch and a second power supply; and a control circuit of a second type, arranged to couple the control terminal of the power switch to the first power supply when the control signal is in the OFF state.

High side driver circuit

Apparatus for detecting faults in the delivery of electrical power to electrical loads, includes a plurality of load electrical connections arranged to deliver electrical power from an electrical power source to each of a plurality of electrical loads, a plurality of electrical switches, each connected to an associated one of the load connections, and a diagnostic device operable to detect a short circuit fault in the apparatus, wherein the diagnostic device is operable to apply a diagnostic procedure to detect a short circuit connection between at least two of the load electrical connections and includes a control logic unit operable to apply to each of the electrical switches in turn a test control signal causing operation of the switch to apply a test electrical signal to each of the load electrical connections in turn; and detector means connected to the load electrical connections and operable, while the test electrical signal is applied in turn to each load electrical connection, to detect whether a corresponding electrical output is produced in response on any of the other load electrical connections. Also described is a method of operation in the apparatus.

A method is intended to make it possible to drive a PTC electrical load element with a switching unit with the highest possible operational reliability. For this purpose, the electric current is switched off if a predetermined current threshold value is exceeded, the magnitude of the current threshold value being determined from the operating parameters of the load element.

Method for driving a PTC electrical load element

A circuit for improving the control of a change in state of a signal in an electronic device between a first state and a second state, wherein a first change in state occurs when the state changes from the second state to the first state and a second change in state occurs when the state changes from the first state to the second state and wherein the first and second changes in state have associated therewith a first and a second time delay over which each change in state occurs, characterized in that said circuit comprises a determining unit for measuring the first time delay and a calculator for calculating a common delay to replace one or more of the first and second delays to thereby improve the control of the change in state of the signal.

System and method to improve switching in power switching applications

A clock circuit which may include a first clock input for receiving a first clock signal and a second clock input for receiving a second clock signal. A clock calibration unit is connected to the first clock input and the second clock input. The calibration unit may calibrate the second clock signal relative to the first clock signal. The clock calibration unit may have a calibration output for outputting a calibrated clock signal. The clock circuit may include a switch unit connected to the first clock input and the calibration output. The switch unit can select a selected clock signal selected from the first clock signal and the calibrated signal. The switch unit has a switch output for outputting the selected clock signal. A switch control unit is connected to the switch unit for controlling which signal is selected based on a selection criterion and a clock circuit output is connected to the switch unit for outputting the selected clock signal.

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Saint Lys, France

Kamel Abouda