Kambix Innovations, LLC

Other

University of California

Lawrence Livermore National Security, LLC

Kambix Innovations Ii, LLC

Kambiz Vafai

Abdul Rahim A Khaled

Andisheh Tavakoli

Mohammad Reza Salimpour

Cengiz S Ozkan

Robert Cort Haddon

Mo Yang

Abdul-Rahim Assaad Khaled

Abdul Rahim Assaad Khaled

Neil Reginald Beer

Adbul Rahim A Khaled

Erfan Kosari

Abdul-Rahim A Khaled

Sainan Lu

Chao Wang

In an embodiment, a method for fast prediction of hotspot temperatures in three-dimensional (3D) integrated circuit (IC) chips, can involve inputting a dataset comprising thermal simulation data and associated parameters for 3D IC chips, wherein the dataset includes variables such as power distribution, processor core location distribution, and Through Silicon Via (TSV) distribution, applying a K-fold Cross Validation (K-CV) algorithm to train a machine learning model using the inputted dataset, wherein the K-CV algorithm is employed to optimize the training process and prevent overfitting, utilizing a Support Vector Regression (SVR) algorithm within the trained machine learning model to predict hotspot temperatures of the 3D IC chips, and adjusting a cooling strategy for cooling the 3D IC chips, in response to monitoring the hotspot temperatures via the trained machine learning model. The 3D IC chip can include a multi-layer structure including a group of vertically stacked semiconductor layers.

Heat transfer enhancement for three-dimensional integrated circuit chips

A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

Thermal management of three-dimensional integrated circuits

A three-dimensional integrated circuit apparatus includes a three-dimensional integrated circuit including a group of integrated double-layer microchannels (DLMC) and multi-layer microchannels (MLMC) with optimized thermal performance for the three-dimensional integrated circuit. A heat source can be uniformly distributed in each layer and can be conducted through the layers down to the substrate and up to a spreader and a heat sink, and eventually to ambient air through forced convective heat transfer above the heat sink and natural convective heat transfer under the substrate.

Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels

A three-dimensional integrated circuit apparatus includes a three-dimensional integrated circuit including a group of integrated double-layer microchannels (DLMC) and multi-layer microchannels (MLMC) with optimized thermal performance for the three-dimensional integrated circuit.

A method and system for noninvasively treating a neurodegenerative disorder, can involve determining characteristics indicative of physical attributes of a central nervous system, the characteristics including parameters for diminishing adverse impacts of a magnetothermal stimulation treatment for a neurodegenerative disorder with respect to the central nervous system, and applying as a part of the magnetothermal stimulation treatment and based on the characteristics of the physical attributes of the central nervous system, a magnetic field to the brain for a thermal stimulation of neuron cells within the brain.

Method and system for thermal stimulation of targeted neural circuits for neurodegenerative disorders

A system for thermal cycling a material to be thermal cycled including a microfluidic heat exchanger; a porous medium in the microfluidic heat exchanger; a microfluidic thermal cycling chamber containing the material to be thermal cycled, the microfluidic thermal cycling chamber operatively connected to the microfluidic heat exchanger; a working fluid at first temperature; a first system for transmitting the working fluid at first temperature to the microfluidic heat exchanger; a working fluid at a second temperature, a second system for transmitting the working fluid at second temperature to the microfluidic heat exchanger; a pump for flowing the working fluid at the first temperature from the first system to the microfluidic heat exchanger and through the porous medium; and flowing the working fluid at the second temperature from the second system to the heat exchanger and through the porous medium.

Rapid microfluidic thermal cycler for nucleic acid amplification

Devices comprising multi-compartment fluidic cell with multiple inlets. Compartments can be separated from one another using soft seals. The main cell can be located between two adjacent secondary cells. The main cell carries the main flow while the secondary cells can carry either the main flow or any auxiliary flows. The flow in the multi-compartment cells minimizes fluid leakage and causes reduced pressure difference between the main cell and the two secondary cells especially under similar flow conditions.

Minimizing flow disturbances in fluidic cells utilizing soft seals

Devices utilized to enhance insulating properties at high temperatures. Such devices can include two gas compartments. A main gas compartment can function as a main layer and generally contains a layer of a gas (e.g., Xenon) having a relatively small thermal conductivity. The plates of the main gas layer can be separated by a soft seal, so that the main gas does not leak and the main layer expands easily. A second gas compartment can be configured as a vented compartment filled with air. At high temperatures, the main gas expands while the secondary gas volume shrinks. Since the main gas possesses a lower thermal conductivity, the effective resistance of the device increases, causing an enhancement in the insulating properties at large operating temperatures. A series of gas compartments can be utilized for additional enhancement in insulating properties.

Enhancing insulating properties at higher temperature utilizing soft seals

Devices for the control of flow rate and thermal conditions using two-layered thin films separated by flexible complex seals. The plates of an upper thin film are separated by a sealing assembly. The sealing assembly is composed of an elastic soft seal separating closed voids of stagnant fluid and in contact with the upper plate of the device as it is the heated plate. The lower and the upper plates of the lower thin film can be separated by an elastic soft seal. The lower and upper thin films are named as main and secondary layers, respectively. Both the upper plate of the secondary layer and the lower plate of the main layer are fixed while the intermediate plate and is free to move in the vertical direction. When the pressure or the working temperature in the secondary layer increases, the secondary layer expands causing the main layer thickness to shrink. This reduces the main layer flow rate and temperature gradients within the main layer.

Control of flow rate and thermal conditions using two-layered thin films separated by flexible seals and rotatable pivot

A cooling enhancement apparatus includes a first substrate and a second substrate, the first substrate having a face in contact with at least one hot medium and having another face in contact with a secondary gas. The second substrate includes a face in contact with the secondary gas and has the other face in contact with a main gas. The faces of the first and second substrates in contact with the secondary gas generally oppose each other. One or more flexible seals can be attached to the first substrate and to the second substrate to form one or more closed enclosures including the secondary gas so that the second substrate moves relative to the first substrate when the secondary gas undergoes volumetric thermal expansion.

Cooling enhancements in thin films using flexible complex seal due to temperature increase or thermal load increase

Devices and methods for increasing and decreasing cooling capacity as thermal load increases by utilizing bimaterial. For increasing the cooling capacity, the upper plate of a thin film microchannel can be configured from a bimaterial, such that the upper layer possesses a higher linear thermal expansion coefficient than that of the lower layer material. Excessive heating causes the coolant temperature to increase which in turn heats the upper plate. As such, the upper plate bends outward allowing for more coolant to flow within the thin film. For decreasing the cooling capacity, the upper plate can be configured from a bimaterial such that its lower layer has a higher linear thermal expansion coefficient than that of the upper layer material. Excessive heating can cause the coolant temperature to increase, which in turn heats the upper plate. As such, the upper plate can bend inward resulting in less coolant flow within the thin film.

Smart passive thermal devices and methods

Disclosed herein are devices comprising at least one flexible seal, at least one flexible complex seal having at least one closed cavity containing a fluid, or a combination thereof. The devices may comprise at least one immobile and inflexible substrate and at least one mobile and inflexible substrate capable of movement due to the flexible seal, the flexible complex seal, or both. The flexible complex seals comprise at least one closed cavity comprising a fluid, such as a gas or a liquid. As disclosed, the presence or absence of heat will cause the mobile and inflexible substrate to move. The movement will increase or decrease the fluid amount or fluid flow rate in the primary fluid layer. Also disclosed are methods for enhancing the insulating properties of insulating assemblies.

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