Intel Corporation

Kambiz R Munshi

Rahul R Shah

Eduard Roytman

Mahalingam Nagarajan

Jian Xu

Ronald L Bedard

Arvind A Kumar

Anup J Deka

An apparatus is described. The apparatus includes a decision feedback equalizer circuit having a summation circuit. The summation circuit has a differential pair that includes first and second transistors coupled to a current source. The current source is to draw a current through the first and second transistors. The decision feedback circuit also includes a circuit to adjust the current to compensate for a change in electron mobility of at least one transistor of the current source.

Decision feedback equalizer circuit with transistor mobility change compensation

Described herein are an apparatus, system, and method for compensating voltage swing and duty cycle of a signal on an input-output (I/O) pad of a processor by adjusting the voltage swing and duty cycle of the signal. The apparatus comprises a driver to transmit a signal on an I/O pad, the signal on the I/O pad having a voltage swing and a duty cycle; and an adjustment unit, coupled to the driver, to receive the signal from the I/O pad transmitted by the driver and to generate voltage swing and duty cycle control signals for adjusting the voltage swing and duty cycle of the signal on the I/O pad respectively. Described herein is also an analog-to-digital (A2D) converter for measuring and/or calibrating various signal attributes including current, voltage, and time.

Apparatus, system, and method for voltage swing and duty cycle adjustment

For one embodiment, an integrated circuit includes a node to couple one or more components to the integrated circuit to carry current through a package for the integrated circuit. The integrated circuit also includes a monitor to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package. For another embodiment, current through one or more components that are to carry current through a package for an integrated circuit is controlled. A resistance of the package is measured based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.

Integrated circuit package resistance measurement

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Shrewsbury, MA, United States of America

Kambiz R Munshi