Manufacturing Integration Technology Ltd

Kam Yee Fong

Han Yong Lam

Francis Medel P Tundag

The present invention provides apparatuses for processing an object just as semiconductor chips and dies. The first embodiment comprises two or more pick and place heads (FIG.) which operate sequentially (ie leap frog) to pick components from a first location to a second. The second embodiment (FIG.) comprises a flipping head combined with a pick and place heads where an object is picked up by the flipping head, turned over and then presented to a pick and place head for relocation to an output.

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Singapore, Singapore

Kam Yee Fong