Kulicke and Soffa Die Bonding Gmbh

Kam-Shing Wong

Michael P Schmidt-Lange

Johannes Schuster

A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.

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Telford, PA, United States of America

Kam-Shing Wong